Light emitting device and resin composition

ABSTRACT

Provided a light emitting device comprising: a package; a light emitting element disposed in the package; an encapsulation member that covers the light emitting element, the encapsulation member being formed from a resin composition that contains a fluorescent material, a resin, and nanoparticles selected from at least one of the group consisting of aluminum oxide nanoparticles, titanium oxide nanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles, and silicon oxide nanoparticles, wherein when the resin composition includes silicon oxide nanoparticles, the content of the silicon oxide nanoparticles is 0.02 to 5 mass parts relative to 100 mass parts of the resin; and wherein the fluorescent material is a red-light emitting fluorescent material including a fluoride material having a chemical composition that includes tetravalent manganese, at least one selected from the group consisting of alkali metal elements and NH 4   + , and at least one selected from the group consisting of elements from Group 4 of the periodic table and elements from Group 14 of the periodic table.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part application of U.S. patentapplication Ser. No. 14/600,372 filed Jan. 20, 2015, now U.S. Pat. No.9,397,276, issued Jul. 19, 2016, and claims priority under 35 USC 119from Japanese patent Application No. 2014-213204, filed Oct. 17, 2014and Japanese patent Application No. 2015-6707, filed Jan. 16, 2015, theentire disclosures of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

Field of the Invention

This disclosure relates to a light emitting device and a resincomposition.

Description of the Related Art

A light emitting diode (LED) is a semiconductor light emitting elementproduced from a metal compound such as gallium nitride (GaN). Varioustypes of light emitting devices that emit light of, e.g., white color,incandescent bulb color, or orange color have been developed using sucha semiconductor light emitting element in combination with a fluorescentmaterial. Such light emitting devices are able to emit, e.g., whitelight by the light color mixture principle. Well known systems that emitwhite light include systems using a light emitting element that emitsultraviolet light and three types of fluorescent materials that emit red(R), green (G), and blue (B) light, and systems using a light emittingelement that emits a blue light and a fluorescent material that emits,e.g., a yellow light. Light emitting devices that employ systems using alight emitting element that emits a blue light and a fluorescentmaterial that emits, e.g., a yellow light are demanded in a wide varietyof fields, including general lighting, car lights, displays, andbacklights for liquid crystals. Of these, fluorescent materials used inlight emitting devices for liquid crystal backlights are desired to haveboth superior light emission efficiency and superior color purity forreproducing colors over a wide range of the chromaticity coordinates.Fluorescent materials used in light emitting devices for liquid crystalbacklights are particularly desired to be advantageously used incombination with color filters and to have an emission peak with anarrow half bandwidth.

Red-light emitting fluorescent materials that exhibit an emission peakwith a narrow half bandwidth and having an excitation band in the blueregion, include, for example, fluoride fluorescent materials havingcompositions such as K₂AlF₅:Mn⁴⁺, K₃AlF₆:Mn⁴⁺, K₃GaF₆:Mn⁴⁺,Zn₂AlF₇:Mn⁴⁺, KIn₂F₇:Mn⁴⁺, K₂SiF₆:Mn⁴⁺, K₂TiF₆:Mn⁴⁺, K₃ZrF₇:Mn⁴⁺,Ba_(0.65)Zr_(0.35)F_(2.70):Mn⁴⁺, BaTiF₆:Mn⁴⁺, K₂SnF₆:Mn⁴⁺, Na₂TiF₆:Mn⁴⁺,Na₂ZrF₆:Mn⁴⁺, KRbTiF₆:Mn⁴⁺, or K₂Si_(0.5)Ge_(0.5)F₆:Mn⁴⁺ (see, e.g.,Japanese Patent Application prior-to-examination Publication (kohyo) No.2009-528429).

To protect the light emitting element and other components of a lightemitting device, the light emitting element as well as wires and theother cables are encapsulated within an encapsulation material thatcontains fluorescent material particles.

SUMMARY OF THE INVENTION

A light emitting device includes a package; a light emitting elementdisposed in the package; an encapsulation member that covers the lightemitting element and that is a cured product of a resin compositioncontaining a fluorescent material, a resin, and nanoparticles selectedfrom at least one of the group consisting of aluminum oxidenanoparticles, titanium oxide nanoparticles, zinc oxide nanoparticles,zirconium oxide nanoparticles, and silicon oxide nanoparticles, whereinwhen the resin composition includes silicon oxide nanoparticles, thecontent of the silicon oxide nanoparticles is 0.02 to 5 mass partsrelative to 100 mass parts of the resin; and; and wherein thefluorescent material is a red-light emitting fluorescent materialincluding fluoride material having a chemical composition that includestetravalent manganese, at least one selected from the group consistingof alkali metal elements and NH₄ ⁺, and at least one selected from thegroup consisting of elements from Group 4 of the periodic table andelements from Group 14 of the periodic table.

The light emitting device reduces losses in emission output andgeneration of chromaticity change, and has superior durability andreliability.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic sectional view of a light emitting deviceaccording to one example embodiment.

FIG. 2 is a schematic sectional view of another example of a lightemitting device according to a second example embodiment.

FIGS. 3A to 3D are photographs showing the results of a pressure cookertest (PCT) of the light emitting devices of Example 1 and ComparativeExamples 1 to 3.

FIG. 4 is a fluorescent micrograph of an enlarged sectional view of alight emitting device according to an example embodiment.

FIGS. 5A to 5D are photographs showing the results of a PCT of the lightemitting devices of Example 2 and Comparative Examples 4 to 6.

DETAILED DESCRIPTION OF THE INVENTION

Mn⁴⁺-activated red-light emitting fluoride fluorescent materials thathave an emission peak with a narrow half bandwidth and that are suitablefor use in backlights are desired to be widely put into practice.

In a conventional Mn⁴⁺-activated fluoride fluorescent material, however,the Mn⁴⁺ that constitutes the fluoride fluorescent material particlereacts with water in the air on its particle surface and generatemanganese dioxide, which colors the particle surface, resulting inchromaticity change or losses in emission output over time. Thus, thereis a concern that light emitting devices using a conventionalMn⁴⁺-activated red-light (emitting) fluorescent material may not besuitable for use in liquid crystal backlights, in which reliability ishighly important.

To solve this problem, one mode of the present disclosure aims toprovide a light emitting device that reduces losses in emission outputand generation of chromaticity change, and that has superior durabilityand improved reliability, and a resin composition used therefor.

Specific means for solving the problem is as follows, and the presentdisclosure includes the following modes.

A first mode of the present disclosure is a light emitting device thatincludes a package; a light emitting element disposed in the package; anencapsulation member that covers the light emitting element and that isa cured product of a resin composition containing a fluorescentmaterial, a resin, and nanoparticles selected from at least one of thegroup consisting of aluminum oxide nanoparticles, titanium oxidenanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles,and silicon oxide nanoparticles, wherein when the resin compositionincludes silicon oxide nanoparticles, the content of the silicon oxidenanoparticles is 0.02 to 5 mass parts relative to 100 mass parts of theresin; and wherein the fluorescent material is a red-light emittingfluorescent material including fluoride material having a chemicalcomposition that includes tetravalent manganese, at least one selectedfrom the group consisting of alkali metal elements and NH₄ ⁺, and atleast one selected from the group consisting of elements from Group 4 ofthe periodic table and elements from Group 14 of the periodic table.

A second mode of the present disclosure is a resin compositioncontaining a fluorescent material, a resin, and nanoparticles selectedfrom at least one of the group consisting of aluminum oxidenanoparticles, titanium oxide nanoparticles, zinc oxide nanoparticles,zirconium oxide nanoparticles, and silicon oxide nanoparticles, whereinwhen the resin composition includes silicon oxide nanoparticles, thecontent of the silicon oxide nanoparticles is 0.02 to 5 mass partsrelative to 100 mass parts of the resin; and the fluorescent material isa red-light emitting fluorescent material including fluoride materialhaving a chemical composition that includes tetravalent manganese, atleast one selected from the group consisting of alkali metal elementsand NH₄ ⁺, and at least one selected from the group consisting ofelements from Group 4 of the periodic table and elements from Group 14of the periodic table.

According to one mode of the present disclosure, a light emitting devicethat reduces losses in emission output and that has superior durabilityand improved reliability, and a resin composition used therefor areprovided.

A light emitting device and a resin composition according to one mode ofthe present disclosure will be explained below. The describedembodiments, however, are mere examples of the light emitting device,the resin composition, and the method for manufacturing them forembodying the technical concept of the present invention, and thepresent invention is by no means limited to the light emitting device,the resin composition, and the method for manufacturing them asdescribed.

The relationship between color names and chromaticity coordinates andthe relationship between the wavelength range of light and the colorname of monochromatic light, for example, are in accordance with JISZ8110. Specifically, the range of 380 nm to 410 nm corresponds to violetcolor, the range of 410 nm to 455 nm corresponds to bluish violet color,the range of 455 nm to 485 nm corresponds to blue, the range of 485 nmto 495 nm corresponds to bluish green, the range of 495 nm to 548 nmcorresponds to green, the range of 548 nm to 573 nm corresponds toyellowish green, the range of 573 nm to 584 nm corresponds to yellow,the range of 584 nm to 610 nm corresponds to yellowish red, and therange of 610 nm to 780 nm corresponds to red.

In the present specification, the term “step” means not only anindependent step but also a step which cannot be clearly distinguishedfrom other steps but can achieve the desired object. Ranges of numericalvalues include the numerical values that appear before and after “to” asthe minimum and the maximum values of the range. For the amount of eachcomponent contained in the encapsulation material, when a plurality ofcompounds corresponding to the component exist, the amount of thecomponent means the total amount of the compounds present in theencapsulation material unless otherwise specified.

Light Emitting Device

FIG. 1 is a sectional view illustrating a schematic structure of a lightemitting device 1 according to a first embodiment.

A light emitting device 1 includes a package 3, a light emitting element4 disposed in the package 3, and an encapsulation member 9 that coversthe light emitting element 4. The package 3 has side walls that define arecess 2. The package 3 includes a first lead 5 and a second lead 6 thattogether form the bottom of the package. The encapsulation member 9 is acured product of a resin composition that includes a red-lightfluorescent material 7 and a fluorescent material 8 that emits lightother than red (hereinafter “a non-red fluorescent material 8”), a resin(not shown), and at least one nanoparticle 13 selected from the groupconsisting of an aluminum oxide nanoparticle, a titanium oxidenanoparticle, a zinc oxide nanoparticle, a zirconium oxide nanoparticle,and a silicon oxide nanoparticle, and when the nanoparticle 13 containsa silicon oxide nanoparticle, the content of the silicon oxidenanoparticle is 0.02 to 5 mass parts relative to 100 mass parts of theresin.

FIG. 1 is not drawn to scale, but merely schematically shows theparticles of a red-light fluorescent material 7, the particles of anon-red fluorescent material 8, and nanoparticles 13 that are containedin the encapsulation member 9.

The red-light fluorescent material 7 is a red-light emitting fluorescentmaterial including a fluoride material having a chemical compositionthat includes tetravalent manganese, at least one selected from thegroup consisting of alkali metal elements and NH₄ ⁺, and at least oneselected from the group consisting of elements from Group 4 of theperiodic table and elements from Group 14 of the periodic table. Thefluorescent material may have a chemical composition represented by theformula (I):A₂[M_(1-x)Mn⁴⁺ _(x)F₆]  (I)

wherein A is at least one selected from the group consisting of alkalimetal elements and NH₄ ⁺; M is at least one selected from the groupconsisting of elements from Group 4 of the periodic table and elementsfrom Group 14 of the periodic table; and x satisfies 0<x<0.2. Thefluorescent material may have a surface region with a lower Mn⁴⁺concentration than the inner region of the fluorescent material. Thenon-red fluorescent material 8 is a fluorescent material that emitslight other than red, specifically, light from green to yellow.

The light emitting element 4 is arranged on the first lead 5 that isdisposed in the bottom portion of the recess 2 of the package 3. Thelight emitting element 4 is connected to positive and negativeelectrodes (not shown), and to the first lead 5 and the second lead 6made of metal, using wires 11 and 12, respectively. The first lead 5 andthe second lead 6 form the bottom of the recess 2 of the package 3.

Package

Although the material for the package having side walls, which define arecess, is not particularly limited, an electrically insulating materialwith superior light resistance and heat resistance is preferably used.Examples of such materials for the package include resins and ceramics.The first and second leads form the bottom of the recess of the package,and are substantially plane-like members on which a light emittingelement or the like can be placed.

Examples of ceramics that may be used as a material for the packageinclude alumina, aluminum nitride, mullite, silicon carbide, and siliconnitride. Calcined ceramic green sheets, which are prepared by mixing aceramic powder with a resin and molding the resultant mixture intosheets, followed by calcination of the laminated sheets, may also beused.

Examples of resins that may be used as a material for the packageinclude epoxy resin and polyamide resin. As a package made of epoxyresin, those prepared by, for example, laminating a copper plate to anepoxy resin that contains glass cloth or to a prepreg that is obtainedby semi-curing such an epoxy resin, may be used.

Light Emitting Element

A light emitting element that emits visible light in a short wavelengthregion may be used as the light emitting element. A light emittingelement that emits, for example, blue to green light, may include, forexample, a nitride semiconductor (In_(X)Al_(Y)Ga_(1-X-Y)N, 0≦X, 0≦Y,X+Y≦1). This enables efficient excitation of a fluorescent material andeffective use of visible light.

The light source (hereinafter also referred to as “excitation lightsource”) of the light emitting element preferably emits light in awavelength range of 380 nm to 573 nm, which is in the short wavelengthregion of visible light. The light source preferably emits light frombluish violet to blue, and has an emission peak wavelength (maximumemission wavelength) in the wavelength range of 420 to 485 nm, and, morepreferably, in the wavelength range of 440 to 480 nm. By using such anexcitation light source, a light emitting device having a high lightemission intensity can be provided.

Using a semiconductor light emitting element as the excitation lightsource provides a highly efficient light emitting device that has highoutput linearity to the input and is resistant and stable to mechanicalimpact.

First Lead and Second Lead

The package includes a first lead and a second lead that are arranged inthe bottom of the recess, and the first lead and the second lead formthe bottom of the recess of the package. The first lead and the secondlead together may be referred to as a conductive member. The first andsecond leads may be composed only of a conductive base material, or mayinclude a base material and a reflection film, or may be composed onlyof a conductive reflection film. Further, the first and second leads maybe composed of a base material, a reflection film, and another memberthat is interposed between the base material and the reflection film.When the conductive member includes a base material and a reflectionfilm, the reflection film is disposed at least on a side on which alight emitting element is disposed.

Base Material for the First Lead and Second Leads

When the base material for the first and second leads is conductive, thebase material may be, for example, copper or an alloy of copper andiron.

Reflection Film of the First and Second Leads

For the reflection film, for example, a material containing at leastsilver or aluminum may be used, and, in particular, a materialcontaining highly reflective silver is preferably used. A materialcontaining a metal such as copper, aluminum, gold, white silver,tungsten, iron, and nickel, or an alloy such as an iron-nickel alloy,phosphorus blue copper, and an iron-copper alloy, in addition to silver,may be used to form the reflection film”.

Insulating Member

The light emitting element, the first lead, the second lead, and thewires are preferably covered with an insulating member. The insulatingmember is preferably provided on the light emitting element, the firstlead, the second lead, and the wires in a continuous manner. As usedherein, “provided . . . in a continuous manner” indicates a state wherethe insulating member is provided in the form of a layer (a film) on thesubject consisting of the light emitting element, the first lead, thesecond lead, and the wires, or a state where the insulating member isprovided in the form of a powder or needles on the light emittingelement, the first lead, the second lead, and the wires substantiallyentirely while leaving partial voids therein. The insulating memberprotects the metals that constitute the light emitting element, thefirst lead, the second lead, and the wires, in particular, silver thatmay be used to form the first and second leads, from gas, water, andfluorine (F) in the fluorescent material, for example, which may modifythe metals. In a case where fluorine contained in the fluorescentmaterial reacts with silver that is contained, for example, in theconductive member, the reaction would produce silver fluoride. Thesilver fluoride would absorb the light emitted by the light emittingelement, which may reduce the emission output. The insulating member canefficiently prevents or reduces the deterioration of silver that iscontained in the first and second leads, thereby enhancing the lightoutput efficiency. The insulating member also functions as a protectingfilm and eliminates migration of silver that is contained in the firstand second leads, for example, by blocking moisture or the like. Thus,the reaction of the migrated silver with fluorine (F), which iscontained in the red-light fluorescent material, can be prevented orreduced.

Insulating Member

The material for the insulating member is preferably translucent, andpreferably contains an inorganic compound. Specific examples of thematerial for the insulating member include oxides, such as SiO₂, Al₂O₃,TiO₂, ZrO₂, ZnO₂, Nb₂O₃, MgO, SrO, In₂O₃, TaO₂, HfO, SeO, and Y₂O₃;nitrides, such as SiN, AlN, and AlON; and fluorides, such as MgF₂. Thesemay be used alone or in combination. Alternatively, two or moreinsulating members that contain at least the above-described materialsmay be layered.

The insulating member preferably has a thickness that would not causeloss of light due to multiple reflection at various interfaces betweenthe conductive member, the insulating member, and the encapsulationmember. The insulating member, in contrast, needs to have a thicknessthat enables it to block, for example, gas, water, and fluorine (F),which is contained in the fluorescent material, from reacting with theconductive member. The thickness of the insulating member slightlyvaries depending on, for example, the materials of the members thatconstitute the light emitting device. The insulating member has athickness of preferably about 1 nm to 100 nm, more preferably 1 nm to 50nm, still more preferably 2 nm to 25 nm, and particularly preferably 3nm to 10 nm.

The insulating member is preferably formed as a film (layer) that ismade of an inorganic compound on the conductive member, the wires andthe light emitting element, by sputtering or deposition. The insulatingmember is more preferably formed as a film (layer) by Atomic LayerDeposition. Atomic Layer Deposition is a method of forming layers ofreactive components, one atomic layer at a time. Atomic Layer Depositioncan form an insulating member (film) as a high-quality protecting filmhaving a uniform film thickness and a uniform film quality with reactivecomponents being uniformly dispersed on the subject regardless ofobstacles or irregularities, unlike a conventional sputtering ordeposition methods. An insulating member (film) formed by Atomic LayerDeposition has a thin film, which can reduce absorption of light. Withsuch an insulating member, a light emitting device having a higherinitial light output can be provided.

Next, an example of forming an insulating member (film) of aluminumoxide (Al₂O₃) by Atomic Layer Deposition will be explained.

First, trimethylaluminum (hereinafter also referred to as “TMA”) gas isintroduced into a chamber containing the subject, specifically, theconductive member, the wires and the light emitting element, and the TMAgas reacts with the OH groups on the surfaces of the subject (firstreaction). Excess gas is then evacuated. Next, H₂O gas is introducedinto the subject, causing H₂O to react with TMA that reacted withOH-group in the first reaction (second reaction). Excess gas is thenevacuated. This single cycle consisting of the first reaction,evacuation, the second reaction, and evacuation, is repeated multipletimes until an aluminum oxide (Al₂O₃) film having the desired thicknessis formed on the surfaces of the conductive member, the wires and thelight emitting element.

Encapsulation Member

The encapsulation member is a cured product of a resin composition thatincludes a red light fluorescent material, a fluorescent material thatemits light other than red, a resin, and nanoparticles selected from atleast one of the group consisting of aluminum oxide nanoparticles,titanium oxide nanoparticles, zinc oxide nanoparticles, zirconium oxidenanoparticles, and silicon oxide nanoparticles, wherein when the resincomposition includes silicon oxide nanoparticles, the content of thesilicon oxide nanoparticles is 0.02 to 5 mass parts relative to 100 massparts of the resin.

Encapsulation Material (Resin Composition)

The encapsulation member is a resin composition that includes afluorescent material, a resin, and nanoparticles selected from at leastone of the group consisting of aluminum oxide nanoparticles, titaniumoxide nanoparticles, zinc oxide nanoparticles, zirconium oxidenanoparticles, and silicon oxide nanoparticles, wherein when the resincomposition includes silicon oxide nanoparticles, the content of thesilicon oxide nanoparticles is 0.02 to 5 mass parts relative to 100 massparts of the resin.

Resin

The resin contained in the resin composition used to form theencapsulation member is preferably translucent so that it allows lightfrom the light emitting element to transmit through it. Specificexamples of suitable resins include a silicone resin, a modifiedsilicone resin, an epoxy resin, a modified epoxy resin, and an acrylicresin. The resin is preferably at least one resin selected from thegroup consisting of a silicone resin, a modified silicone resin, anepoxy resin, a modified epoxy resin, and an acrylic resin. The resin mayalso be a silicone resin, an epoxy resin, an urea resin, a fluorineresin, or a combination of these resins. Of these, a modified siliconeresin is preferable, and a phenyl silicone resin prepared by introducinga phenyl group into a side chain of polysiloxane is more preferable. Theresin preferably contains a phenyl silicone resin.

The content of the resin in the resin composition is preferably 5 to 95mass % in 100 mass % of the resin composition, more preferably 35 to 85mass %, still more preferably 40 to 80 mass %, and particularlypreferably 45 to 75 mass %. With the resin content being 5 to 95 mass %in 100 mass % of the resin composition, the resin composition aftercuring can safely protect the members, including a light emittingelement, that are arranged in the recess. With the content of the resinin the resin composition within the above range, the encapsulationmember can contain a sufficient amount of fluorescent particles forcovering the light emitting element.

Nanoparticles

The resin composition forming the encapsulation member containsnanoparticles selected from at least one of the group consisting ofaluminum oxide nanoparticles, titanium oxide nanoparticles, zinc oxidenanoparticles, zirconium oxide nanoparticles, and silicon oxidenanoparticles.

The resin composition may contain nanoparticles selected at least one ofthe group consisting of aluminum oxide nanoparticles, titanium oxidenanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles,and silicon oxide nanoparticles, or a combination of nanoparticles of atleast two selected from the group. The resin composition may alsocontain either zirconium oxide nanoparticles or silicon oxidenanoparticles, or both of them. When the resin composition contains twoor more types of nanoparticles, their ratio is not particularly limitedand may be appropriately selected depending on, for example, thepurpose.

Due to the presence of the nanoparticles, fluorescent particles are welldispersed in the encapsulation member formed from the resin compositioncontaining nanoparticles, and the reaction between the fluorescentparticles and water is prevented or reduced. With such an encapsulationmember, a light emitting device that demonstrates superior durability ina long-term reliability test can be provided.

In the encapsulation member formed from the resin composition,nanoparticles are preferably substantially uniformly dispersed. Here,the state where nanoparticles are substantially uniformly dispersed inthe encapsulation member indicates that in any cross-section of thecured encapsulation member observed, the nanoparticles that existtherein have a cross-sectional area, and the difference between thenumber of the nanoparticles that exist within a given area of aparticular cross section and the average number of such nanoparticles islimited to a predetermined range, and that nanoparticles are notunevenly or locally distributed in any cross-section. For example, ifnanoparticles are not unevenly distributed or locally distributed inmultiple locations, under electron microscopy observation at anymagnification within any visual field range, in any cross section of thecured encapsulation member, then the nanoparticles can be said to besubstantially uniformly dispersed.

Zirconium oxide nanoparticles (also called “zirconia nanoparticles”)have a number average primary particle size of preferably 1 nm to 100nm, more preferably 2 nm to 80 nm, still more preferably 2 nm to 60 nm,and particularly preferably 2 nm to 50 nm as determined by transmissionelectron microscopy (TEM).

When the resin composition contains zirconium oxide nanoparticles, thecontent of the zirconium oxide nanoparticles is preferably 0.1 to 30mass parts, more preferably 0.5 to 30 mass parts, still more preferably0.8 to 28 mass parts, particularly preferably 1 to 27 mass parts, andmost preferably 3 to 25 mass parts relative to 100 mass parts of theresin in the resin composition.

The resin composition that constitutes the encapsulation member maycontain zirconium oxide nanoparticles having a relatively small primaryparticle size. This enables the resin composition to maintain the samecolor tone with less fluorescent material in the resin composition thanconventional resin compositions because the zirconium oxidenanoparticles dispersed in the resin composition cause Rayleighscattering of light, thereby enhancing the scattering effect of lightfrom the light emitting element. Additionally, with less fluorescentmaterial in the resin composition, the reaction between the fluorescentmaterial with water can further be prevented. By using a resincomposition containing zirconium oxide nanoparticles, a light emittingdevice that demonstrates superior durability in a long-term reliabilitytest can be provided.

Silicon Oxide Nanoparticles

Silicon oxide nanoparticles (also referred to as “silica nanoparticles”)have a number average primary particle size of preferably 1 nm to 100nm, more preferably 5 nm to 90 nm, still more preferably 8 nm to 80 nm,and particularly preferably 10 nm to 70 nm as determined by TEM.

When the resin composition contains silicon oxide nanoparticles, thecontent of the silicon oxide nanoparticles is preferably 0.02 to 5 massparts, preferably 0.05 to 3 mass parts, more preferably 0.1 to 2 massparts, still more preferably 0.2 to 1 mass parts, and particularlypreferably 0.3 to 0.8 mass parts relative to 100 mass parts of the resinin the resin composition.

By containing a specific amount of silicon oxide nanoparticles in theresin composition, the resin composition that constitutes theencapsulation member has a high viscosity. This helps the fluorescentparticles to be more dispersible, resulting in the fluorescent particlesbeing uniformly dispersed in the cured resin composition, preventing thefluorescent particles from localizing in the surface area of the curedresin composition, thereby further preventing the fluorescent particlesfrom reacting with water. In this manner, by using a resin compositioncontaining silicon oxide nanoparticles, a light emitting device thatproves superior durability in a long-term reliability test can beprovided.

Other Nanoparticles

The resin composition may contain other nanoparticles in addition tozirconium oxide nanoparticles and silicon oxide nanoparticles. Examplesof such other nanoparticles include aluminum oxide nanoparticles,titanium oxide nanoparticles, and zinc oxide nanoparticles. Thesenanoparticles each have a number average primary particle size ofpreferably 1 nm to 100 nm, more preferably 2 nm to 80 nm, still morepreferably 2 nm to 60 nm, and particularly preferably 2 nm to 50 nm asdetermined by TEM.

The content of the other nanoparticles is preferably 0.1 to 30 massparts, more preferably 0.5 to 30 mass parts, still more preferably 0.8to 28 mass parts, particularly preferably 1 to 27 mass parts, and mostpreferably 3 to 25 mass parts relative to 100 mass parts of the resin inthe resin composition.

Filler

The resin composition that constitutes the encapsulation member maycontain a filler besides nanoparticles. The filler contained in theresin composition that constitutes the encapsulation member has a volumeaverage particle size of its secondary particle of preferably above 1000nm. The filler has a volume average particle size (median size: d50) ofits secondary particle of preferably 5 μm to 100 μm, more preferably 7μm to 90 μm, still more preferably 8 μm to 80 μm, particularlypreferably 10 μm to 60 μm, and most preferably 10 μm to 50 μm asdetermined by a particle size analyzer based on a laser differentialscattering method.

The material of the filler may be at least one inorganic materialselected from the group consisting of inorganic oxides, metal nitrides,metal carbides, carbon compounds and sulfides. Examples of the inorganicoxides include titanium oxide, tantalum oxide, niobium oxide, tungstenoxide, zirconium oxide (zirconia), zinc oxide, indium oxide, tin oxide,hafnium oxide, yttrium oxide, silicon oxide (silica), and aluminum oxide(alumina). A complex inorganic oxide thereof may also be used. Anexample of the metal nitride is silicon nitride. An example of the metalcarbide is silicon carbide. Examples of the carbon compound includetranslucent inorganic materials such as diamond and diamond-like-carbon,although they are a single body of carbon. Examples of the sulfidesinclude copper sulfide and tin sulfide. Examples of the other materialsfor the filler include barium titanate, calcium phosphate, calciumcarbonate, white carbon, talc, magnesium carbonate, boron nitride, andfiberglass. Of these, the material for the filler is preferably alumina,silica, or zirconia. In particular, the material of the filler ispreferably silica. The shape of the filler may be spherical, flaky, ormultiple forms produced by pulverizing agglomerates, and a sphericalshape is preferable.

When the resin composition contains a filler, the content of the fillerin the resin composition is preferably 0.1 to 50 mass parts, morepreferably 0.2 to 45 mass parts, still more preferably 0.5 to 40 massparts, and particularly preferably 1 to 35 mass parts relative to 100mass parts of the resin.

With the content of the filler being 0.1 to 50 mass parts relative to100 mass parts of the resin, the components of the resin compositionhave improved dispersibility, and thus, for example, when a red-lightfluorescent material and a fluorescent material that emits light fromgreen to yellow (hereinafter “green to yellow-light emitting fluorescentmaterial”) are contained, the particles of the red-light fluorescentmaterial and the green to yellow-light emitting fluorescent material canbe substantially uniformly dispersed in the encapsulation material.Here, the state where the fluorescent particles are substantiallyuniformly dispersed in the cured resin composition (encapsulationmember) indicates that in any cross-section of the cured resincomposition (encapsulation member) observed, the difference between thenumber of the fluorescent particles that exist in a given range and theaverage number of such fluorescent particles is limited to apredetermined range, and that the fluorescent particles are not locallydistributed in the cross-section. For example, if the fluorescentparticles are not unevenly or locally dispersed in multiple locations,under electron microscopy observation at any magnification within anyvisual field range, in any cross section of a cured resin composition(encapsulation member), then the fluorescent particles can be said to besubstantially uniformly dispersed in the cured resin composition(encapsulation member).

The filler contained in the resin composition allows the fluorescentmaterial particles to be substantially uniformly dispersed in the resincomposition. The filler also allows approximately equal amounts ofinjection of the fluorescent material particles and the nanoparticlesinto the recess of each package when a resin composition, whichconstitutes the encapsulation member, is injected, thereby producing alight emitting device that has less variation in color tone amongpackages.

Red-Light Fluorescent Material

The fluorescent material includes a red-light emitting fluorescentmaterial that is a fluoride material having a chemical composition thatincludes tetravalent manganese, at least one selected from the groupconsisting of alkali metal elements and NH₄ ⁺, and at least one selectedfrom the group consisting of elements from Group 4 of the periodic tableand elements from Group 14 of the periodic table. The fluorescentmaterial may have a chemical composition, for example, represented bythe formula (I):A₂[M_(1-x)Mn⁴⁺ _(x)F₆]  (I)wherein A is at least one selected from the group consisting of alkalimetal elements and NH₄ ⁺; M is at least one selected from the groupconsisting of elements from Group 4 of the periodic table and elementsfrom Group 14 of the periodic table; and x satisfies 0<x<0.2.

The fluorescent material may be a particle that has a surface regionwith a lower Mn⁴⁺ concentration than the inner region of the fluorescentmaterial.

The red-light fluorescent material that has a surface region with alower Mn⁴⁺ concentration than the inner region of the fluorescentmaterial, is more superior in moisture resistance and demonstratesimproved durability in a long-term reliability test. This mechanism willbe elaborated below.

In conventional red-light fluoride fluorescent particles that have achemical composition represented by the formula (I), a Mn⁴⁺ in thefluoride may react with water at the surface region of the particles toproduce manganese dioxide, which discolors the particle surface, causinglosses in the emission output. Thus, conventional red-light fluoridefluorescent materials have failed to achieve sufficient durability in along-term reliability test, and have long believed not to be suitablefor applications in which reliability is highly important.

In contrast, the red-light fluorescent material according to one mode ofthe present disclosure has a surface region with a lower Mn⁴⁺concentration than the inner region of the fluorescent material. Thus,the generation of manganese dioxide on the particle surface is reduced,thereby moderating the losses in emission output and the generation ofchromaticity change over time. This enables to achieve long-termreliability of the product.

Although the particle size and particle size distribution of a red-lightfluorescent material having a chemical composition represented by theformula (I) is not particularly limited, a single peak particle sizedistribution is preferable, and more preferably a single peak particlesize distribution with a narrow distribution width, to achieve superioremission intensity and durability. The surface area and the bulk densityof the red-light fluorescent material are not particularly limited.

The red-light fluorescent material is a Mn⁴⁺-activated fluorescentmaterial, and emits red-light by absorbing light in the short wavelengthregion of visible light. The excitation light, which is in the shortwavelength region of visible light, is light preferably mainly in theblue region. The excitation light preferably has a main peak wavelength(emission peak wavelength) of the intensity spectra in the range of,specifically, 380 nm to 573 nm, more preferably 380 nm to 500 nm, stillmore preferably 380 nm to 485 nm, even more preferably 400 nm to 485 nm,and particularly preferably 440 nm to 480 nm.

The emission wavelength of the red-light fluorescent material is notparticularly limited as long as it is red light and has a longerwavelength than the excitation light. The emission spectrum of thered-light fluorescent material preferably has a peak wavelength in therange of 610 nm to 650 nm. The half bandwidth of the emission spectrumis preferably small, and is specifically preferably 10 nm or less.

A in the formula (I) is at least one selected from the group consistingof alkali metal elements and NH₄ ⁺ and may be at least one cationselected from the group consisting of potassium (K⁺), lithium (Li⁺),sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺). When Aincludes potassium, the percentage of potassium in A is not particularlylimited, and is preferably 50 mol % or more, and more preferably 80 mol% or more, for example.

M in the formula (I) is at least one element selected from the groupconsisting of elements from Group 4 of the periodic table and elementsfrom Group 14 of the periodic table. To achieve superior light emittingproperties, M is preferably at least one element selected from the groupconsisting of titanium (Ti), zirconium (Zr), hafnium (Hf), silicon (Si),germanium (Ge), and tin (Sn), and, more preferably, M includes silicon(Si) or both silicon (Si) and germanium (Ge), and more preferablysilicon (Si), or both silicon (Si) and germanium (Ge).

When M includes silicon (Si) or both silicon (Si) and germanium (Ge), atleast one of Si and Ge may be partially substituted by at least oneelement selected from the group consisting of elements from Group 4 ofthe periodic table, which includes Ti, Zr and Hf, and elements fromGroup 14 of the periodic table, which include C and Sn. In that case,the total percentage of Si and Ge in M is not particularly limited, andis preferably 50 mol % or more, and more preferably 80 mol % or more,for example.

The red-light fluorescent material may have an inner region, which isformed in the 1st step, and a surface region having a lower Mn⁴⁺concentration than the inner region of the fluorescent material. Thesurface region is formed in the 2nd step and the 3rd step as well as inthe 2'nd step.

The surface region of the red-light fluorescent material may have alower Mn⁴⁺ concentration than the inner region of the fluorescentmaterial. The surface region may be clearly separated from the innerregion by the interface between them so that the two regions form atwo-layered structure. Alternatively, the surface region may not beseparated by a clear interface from the inner region, with a gradient inMn⁴⁺ concentration that gradually decreases from the inner side towardthe outer side of the surface region.

The red-light fluorescent particles that are produced from themanufacturing process to be described later exhibit, as particles as awhole, one of the features of the Mn⁴⁺ activated red-light fluorescentmaterial of the present disclosure that the color reproduction range(color gamut) of the image display apparatus is broader than that ofconventional red-light fluorescent materials. While maintaining thisfeature, even when the surface of the red-light fluorescent material isdeteriorated due to moisture, less manganese dioxide derived from a Mn⁴⁺is generated because there is no or little Mn⁴⁺ in the surface region.This, in turn, reduces discoloration of the surface of the red-lightfluorescent material and losses in the emission output.

The average value of the Mn⁴⁺ concentration in the surface region of thered-light fluorescent material is preferably up to 30 mass %, morepreferably up to 25 mass %, and still more preferably up to 20 mass % ofthe average value of the Mn⁴⁺ concentration in the inner region. TheMn⁴⁺ concentration in the surface region may be set to at least 0.5 mass% of that of the inner region. As stated above, as the Mn⁴⁺concentration becomes closer to zero, the moisture resistance improves.With the decrease in the Mn⁴⁺ concentration in the surface region,however, the percentage of a portion that does not contribute toemitting light increases in the surface region of the fluoridefluorescent material particles. This is likely to cause reduction in theemission intensity.

The thickness of the surface region is preferably about 1/10 to 1/50 ofthe average particle size, although it varies depending on the particlesize of the red-light fluorescent material. When the average particlesize of the red-light fluorescent material is from 20 μm to 40 μm, thethickness of the surface region is up to 2 μm, and preferably up to 1μm.

The red-light fluorescent particles are prepared such that when theparticles are introduced into pure water with a volume of 1 to 5-timesthe mass of the red-light fluorescent particles, the amount of elutionof the tetravalent manganese ion at 25° C. falls within the range of,for example, 0.05 ppm to 3 ppm. The amount of elution of the tetravalentmanganese ion under these conditions is preferably from 0.1 ppm to 2.5ppm, and still more preferably 0.2 ppm to 2.0 ppm. As the amount ofelution of the tetravalent manganese ion decreases, the moistureresistance increases. However, as the percentage of the surface regionwith less Mn⁴⁺ ions increases, the emission intensity is likely todecrease, as stated above. The amount of elution of manganese ion can bemeasured as follows: The red-light fluorescent particles are introducedinto pure water with a volume of 1 to 5-times (preferably 3-times) themass of the red-light fluorescent particles, and the mixture is stirredat 25° C. for 1 hour. To the mixture, a reducing agent is added to elutemanganese ions in the mixture liquid. The eluted supernatant iscollected and measured by quantitative analysis with ICP emissionspectrometry.

Such a configuration of the red-light fluorescent particles reduceslosses of the emission output caused by the coloring of the surface ofthe red-light fluorescent due to generation of manganese dioxide that isderived from the Mn⁴⁺ ions of the fluorescent material, and achieves ared-light fluorescent material with high moisture resistance.

The moisture resistance of the red-light fluorescent material can beevaluated by color change in a pressure cooker test (PCT). Additionally,the moisture resistance can be evaluated, for example, by themaintenance percentage of light emission brightness after waterresistance test, specifically, the percentage (%) of light emissionbrightness after water resistance test relative to light emissionbrightness before water resistance test. The maintenance percentage oflight emission brightness after water resistance test is preferably 85%or more, and more preferably 90% or more.

Here, the water resistance test is carried out specifically byintroducing red-light fluorescent material particles into water with avolume of 1 to 5-times (preferably 3-times) the mass of the red-lightfluorescent material particles, and stirring the mixture at 25° C. for 1hour.

Process for producing Red-light Fluorescent Material

The red-light fluorescent material that has a chemical compositionrepresented by the formula (I) and has a surface region with a lowertetravalent manganese ion concentration than the inner region of thefluorescent material can be produced by the production processincluding, for example, a first step of producing the inner region(hereinafter also called “the core portion”), a second step of producingthe surface region, and a third step.

First Step

The process for producing a red-light fluorescent material includes afirst step of preparing a fluoride particle (core portion) that has achemical composition represented by the formula (I). The preparationstep may include a step of producing a fluoride particle that has achemical composition represented by the formula (I).

A fluoride particle that has a chemical composition represented by theformula (I) can be produced by contacting a first complex ion thatcontains a tetravalent manganese ion; at least one cation selected fromthe group consisting of potassium (K⁺), lithium (Li⁺), sodium (Na⁺),rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺); and a second complexion containing at least one element selected from the group consistingof elements from Group 4 of the periodic table and elements from Group14 of the periodic table in a liquid medium that contain hydrogenfluoride.

A fluoride particle that has a chemical composition represented by theformula (I) can be produced by, for example, a production processincluding a step of mixing a Solution a that contains at least a firstcomplex ion containing a tetravalent manganese ion, a second complex ioncontaining a fluorine ion and at least one element selected from thegroup consisting of elements from Group 4 of the periodic table andelements from Group 14 of the periodic table, and hydrogen fluoride,with a Solution b that contains at least one cation selected from thegroup consisting of K⁺, Li⁺, Na⁺, Rb⁺, Cs⁺ and NH₄ ⁺ and hydrogenfluoride (hereinafter also referred to as “A first process for producinga fluoride”).

Solution a

Solution a is a hydrofluoric acid solution containing a first complexion that contains a tetravalent manganese ion, and a second complex ionthat contains at least one element selected from the group consisting ofelements from Group 4 of the periodic table and elements from Group 14of the periodic table and a fluorine ion.

The manganese source that constitutes a first complex ion containing atetravalent manganese is not particularly limited as long as it is acompound containing manganese. Specific examples of the manganese sourcecapable of forming Solution a include K₂MnF₆, KMnO₄, and K₂MnCl₆. Ofthese, K₂MnF₆ is preferable, mainly because it can stably present inhydrofluoric acid in the form of MnF₆ complex ions while maintainingoxidation number (tetravalent) to be activated. The manganese sourcescontaining at least one cation selected from the group consisting ofpotassium (K⁺), lithium (Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium(Cs⁺), and ammonium (NH₄ ⁺) can also serve as the cation source ofSolution b. The manganese sources for the first complex ions may be usedalone or in combination.

The concentration of the first complex ion in Solution a is notparticularly limited. The lower limit of the concentration of the firstcomplex ion in Solution a is usually 0.01 mass % or more, preferably0.03 mass % or more, and more preferably 0.05 mass % or more. The upperlimit of the concentration of the first complex ion in Solution a isusually 50 mass % or less, preferably 40 mass % or less, and morepreferably 30 mass % or less.

The second complex ions preferably contain at least one element selectedfrom the group consisting of titanium (Ti), zirconium (Zr), hafnium(Hf), silicon (Si), germanium (Ge), and tin (Sn), and more preferablycontain silicon (Si), or both silicon (Si) and germanium (Ge), and,still more preferably, the second complex ions are silicon fluoridecomplex ions.

When, for example, the second complex ions contain silicon (Si), thesource of the second complex ions is preferably a compound that containssilicon and fluorine and that is highly soluble in the solution.Specific examples of the source of the second complex ions includeH₂SiF₆, Na₂SiF₆, (NH₄ ⁺)₂SiF₆, Rb₂SiF₆, and Cs₂SiF₆. Of these, H₂SiF₆ ispreferable, because it is highly soluble in water, and contains noalkali metal element as an impurity. The sources of the second complexions may be used alone or in combination.

The lower limit of the concentration of the source of the second complexions in Solution a is usually 5 mass % or more, preferably 10 mass % ormore, and more preferably 15 mass % or more. The upper limit of theconcentration of the source of the second complex ions in Solution a isusually 80 mass % or less, preferably 70 mass % or less, and morepreferably 60 mass % or less.

The lower limit of the concentration of hydrogen fluoride in Solution ais usually 20 mass % or more, preferably 25 mass % or more, and morepreferably 30 mass % or more. The upper limit of the concentration ofhydrogen fluoride in Solution a is usually 80 mass % or less, preferably75 mass % or less, and more preferably 70 mass % or less.

Solution b

Solution b contains at least one cation selected from the groupconsisting of potassium (K⁺), lithium (Li⁺), sodium (Na⁺), rubidium(Rb⁺), cesium (Cs⁺) and ammonium (NH₄ ⁺), and hydrogen fluoride, and maycontain additional components as necessary. Solution b is obtained as anaqueous hydrofluoric acid solution containing, for example, at least onecation selected from the group consisting of potassium (K⁺), lithium(Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺).

Specific examples of the potassium source containing potassium cationcapable of constituting Solution b include water-soluble potassium saltssuch as KF, KHF₂, KOH, KCl, KBr, KI, potassium acetate, and K₂CO₃. Ofthese, KHF₂ is preferable, because it is soluble in the solution withoutreducing the concentration of hydrogen fluoride, and it has a low heatof dissolution and is highly safe.

Specific examples of the sodium source containing sodium cations capableof constituting Solution b include water-soluble sodium salts such asNaF, NaHF₂, NaOH, NaCl, NaBr, NaI, sodium acetate, and Na₂CO₃.

Specific examples of the rubidium source containing rubidium cationscapable of constituting Solution b include water-soluble rubidium saltssuch as RbF, rubidium acetate, and Rb₂CO₃.

Specific examples of the cesium source containing cesium cations capableof constituting Solution b include water-soluble cesium salts such asCsF, cesium acetate, and Cs₂CO₃.

Specific examples of the ammonium source containing quaternary ammoniumcations capable of constituting Solution b include water-solubleammonium salts such as NH₄F, aqueous ammonia, NH₄Cl, NH₄Br, NH₄I,ammonium acetate, and (NH₄ ⁺)₂CO₃. The ion sources constituting Solutionb may be used alone or in combination.

The lower limit of the concentration of hydrogen fluoride in Solution bis usually 20 mass % or more, preferably 25 mass % or more, and morepreferably 30 mass % or more. The upper limit of the concentration ofhydrogen fluoride in Solution b is usually 80 mass % or less, preferably75 mass % or less, and more preferably 70 mass % or less.

The lower limit of concentration of cations in Solution b is usually 5mass % or more, preferably 10 mass % or more, and more preferably 15mass % or more. The upper limit of the concentration of the at least onecation selected from the group consisting of potassium (K⁺), lithium(Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺)in Solution b is usually 80 mass % or less, preferably 70 mass % orless, and more preferably 60 mass % or less.

The method of mixing Solution a and Solution b is not particularlylimited. Solution b may be added while stirring Solution a, or Solutionb may be added while stirring Solution a. Alternatively, Solutions a andb each may be charged into a container and mixed by stirring.

Mixing Solution a with Solution b allows the first complex ion, the atleast one cation selected from the group consisting of potassium (K⁺),lithium (Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium(NH₄ ⁺), and the second complex ions to react with one another inpredetermined proportions to precipitate as crystals of the desiredfluoride. The precipitated crystals can be collected by solid-liquidseparation through filtration, for example. The precipitated crystalsmay be washed with a solvent such as ethanol, isopropyl alcohol, water,and acetone. The crystals may be then dried usually at 50° C. or more,preferably at 55° C. or more, and more preferably at 60° C. or more, andusually at 110° C. or less, preferably 100° C. or less, and morepreferably 90° C. or less. The drying time is not particularly limitedas long as water remaining on the fluoride particles is vaporized, andit is 10 hours, for example.

In mixing Solution a with Solution b, it is preferable to suitablyadjust the mixing ratio so as to obtain a product, or fluorideparticles, having the intended chemical composition, considering thedifference between the initial composition of Solution a and Solution band the chemical composition of the resultant fluoride particles.

The fluoride particle (core portion) having a chemical compositionrepresented by the formula (I) can also be produced by the productionprocess comprising the step of mixing a first solution containing atleast a first complex ion that contains a tetravalent manganese ion andhydrogen fluoride; a second solution containing at least one cationselected from the group consisting of potassium (K⁺), lithium (Li⁺),sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺), and atleast hydrogen fluoride; a third solution containing at least a secondcomplex ion that contains at least a fluorine ion and at least oneelement selected from the group consisting of elements from Group 4 ofthe periodic table and elements from Group 14 of the periodic table(hereinafter also called “A second process for producing a fluoride”).

By mixing the first solution, the second solution, and the thirdsolution, fluoride particles having the desired composition and thedesired weight median size, can be easily produced at high productivity.

First Solution

The first solution may contain at least a first complex ion thatcontains a tetravalent manganese ion and hydrogen fluoride, and maycontain other components as necessary. The first solution is obtainedas, for example, an aqueous hydrofluoric acid solution containing atetravalent manganese source. The manganese source is not particularlylimited as long as it is a compound containing manganese. Specificexamples of the manganese sources capable of constituting the firstsolution include K₂MnF₆, KMnO₄, and K₂MnCl₆. Of these, K₂MnF₆ ispreferable, mainly because it can stably present in hydrofluoric acid inthe form of MnF₆ complex ions, while maintaining the oxidation number(tetravalent) to be activated. When the manganese source contains atleast one cation selected from the group consisting of K⁺, Li⁺, Na⁺,Rb⁺, Cs⁺, and NH₄ ⁺, it can serve as a source of at least one cationselected from the group consisting of source K⁺, Li⁺, Na⁺, Rb⁺, Cs⁺, andNH₄ ⁺ to be contained in a second solution. The manganese sourcesconstituting the first solution may be used alone or in combination.

The lower limit of the concentration of hydrogen fluoride in the firstsolution is usually 20 mass % or more, preferably 25 mass % or more, andmore preferably 30 mass % or more. The upper limit of the concentrationof hydrogen fluoride in the first solution is usually 80 mass % or less,preferably 75 mass % or less, and more preferably 70 mass % or less.When the hydrogen fluoride concentration is 30 mass % or more, themanganese source (e.g., K₂MnF₆) constituting the first solution is morestable to hydrolysis, and the concentration of the tetravalent manganesein the first solution less fluctuates. This facilitates control of theamount of the manganese for activation that is contained in the fluoridefluorescent materials, and is likely to reduce variation (fluctuation)in light emitting efficiency of the fluoride fluorescent materials. Whenthe concentration of hydrogen fluoride is 70 mass % or less, reductionof the boiling point of the first solution can be prevented or reduced,and the generation of hydrogen fluoride gas can be prevented or reduced.This facilitates control of the concentration of hydrogen fluoride inthe first solution, effectively reducing the variation (fluctuation) inparticle size of the resultant fluoride fluorescent materials.

The concentration of the first complex ion in the first solution is notparticularly limited. The lower limit of the concentration of the firstcomplex ion in the first solution is usually 0.01 mass % or more,preferably 0.03 mass % or more, and more preferably 0.05 mass % or more.The upper limit of the concentration of the first complex ion in thefirst solution is usually 50 mass % or less, preferably 40 mass % orless, and more preferably 30 mass % or less.

Second Solution

The second solution contains hydrogen fluoride and at least one cationselected from the group consisting of K⁺, Li⁺, Na⁺, Rb⁺, Cs⁺, and NH₄ ⁺,and may contain additional components as necessary. The second solutionis obtained, for example, as an aqueous hydrofluoric acid solution thatcontains at least one cation selected from the group consisting of, forexample, K⁺, Li⁺, Na⁺, Rb⁺, Cs⁺, and NH₄ ⁺. Specific examples of the ionsources containing ions capable of constituting the second solutioninclude water-soluble salts such as NaF, NaHF₂, NaOH, NaCl, NaBr, NaI,sodium acetate, Na₂CO₃, RbF, rubidium acetate, Rb₂CO₃, CsF, cesiumacetate, Cs₂CO₃, NH₄F, aqueous ammonia, NH₄Cl, NH₄Br, NH₄I, ammoniumacetate, and (NH₄ ⁺)₂CO₃, in addition to potassium-containing salts suchas KF, KHF₂, KOH, KCl, KBr, KI, potassium acetate, and K₂CO₃. Of these,using at least KHF₂ is preferable, because it is soluble in the solutionwithout lowering the concentration of hydrogen fluoride, and it has alow heat of dissolution and is highly safe. Besides potassium, NaHF₂ ispreferable as a source of the ions. The ion sources that constitute thesecond solution may be used alone or in combination.

The lower limit of the concentration of hydrogen fluoride in the secondsolution is usually 20 mass % or more, preferably 25 mass % or more, andmore preferably 30 mass % or more. The upper limit of the concentrationof hydrogen fluoride in the second solution is usually 80 mass % orless, preferably 75 mass % or less, and more preferably 70 mass % orless.

The lower limit of the ion concentration of the at least one cationselected from the group consisting of K⁺, Li⁺, Na⁺, Rb⁺, Cs⁺, and NH₄ ⁺in the second solution is usually 5 mass % or more, preferably 10 mass %or more, and more preferably 15 mass % or more. The upper limit of theion concentration of the at least one cation selected from the groupconsisting of K⁺, Li⁺, Na⁺, Rb⁺, Cs⁺, and NH₄ ⁺ in the second solutionis usually 80 mass % or less, preferably 70 mass % or less, and morepreferably 60 mass % or less.

Third Solution

The third solution contains at least the second complex ions containingfluorine ions and at least one element selected from the groupconsisting of elements from Group 4 of the periodic table and elementsfrom Group 14 of the periodic table, and may contain additionalcomponents as necessary. The third solution can be obtained, forexample, as an aqueous solution containing the second complex ions.

The second complex ions preferably contain at least one element selectedfrom the group consisting of titanium (Ti), zirconium (Zr), hafnium(Hf), silicon (Si), germanium (Ge), and tin (Sn), more preferablycontain silicon (Si), or silicon (Si) and germanium (Ge), and, stillmore preferably, the second complex ions are silicon fluoride complexions.

When the second complex ions contain, for example, silicon (Si), thesource of the second complex ions preferably is a compound that containssilicon and fluorine, and is highly soluble in the solution. Specificexamples of such sources of the second complex ions include H₂SiF₆,Na₂SiF₆, (NH₄ ⁺)₂SiF₆, Rb₂SiF₆, and Cs₂SiF₆. Of these, H₂SiF₆ ispreferable, because it is highly soluble in water and contains no alkalimetal element as an impurity. The sources of the second complex ionsconstituting the third solution may be used alone or in combination.

The lower limit of the concentration of the second complex ions in thethird solution is usually 5 mass % or more, preferably 10 mass % ormore, and more preferably 15 mass % or more. The upper limit of theconcentration of the second complex ions in the third solution isusually 80 mass % or less, preferably 70 mass % or less, and morepreferably 60 mass % or less.

The method of mixing the first, second, and third solutions is notparticularly limited. The second and third solutions may be added whilestirring the first solution, or the first and third solutions may beadded while stirring the second solution, or the first and secondsolutions may be added while stirring the third solution. Alternatively,the first solution, the second solution and the third solution each maybe charged into a container and then mixed by stirring.

Mixing the first, second and third solutions allows the first complexions, at least one cation selected from the group consisting of K⁺, Li⁺,Na⁺, Rb⁺, Cs⁺, and NH₄ ⁺, and the second complex ions to react with oneanother in predetermined proportions to precipitate fluoride crystalshaving a chemical composition represented by the formula (I). Theprecipitated fluoride particles can be collected by solid-liquidseparation through filtration, for example. The precipitated crystalsmay be washed with a solvent such as ethanol, isopropyl alcohol, water,and acetone. The precipitated crystals may further be dried, usually at50° C. or more, preferably at 55° C. or more, and more preferably at 60°C. or more, and usually at 110° C. or less, preferably at 100° C. orless, and more preferably at 90° C. or less. The drying time is notparticularly limited as long as water remaining on the fluorideparticles is vaporized, and is 10 hours, for example.

In mixing the first, second and third solutions, it is preferable tosuitably adjust the mixing ratio so as to obtain a product, or fluorideparticles, having the intended composition, considering the differencebetween the initial composition of the first, second and thirdsolutions, and the composition of the resultant fluoride particles.

Second Step

In the second step, a reducing agent is added to the dispersed substancecontaining fluoride particles that is obtained in the first step. Byadding a reducing agent, at least a part of the first complex ionscontained in the dispersed substance is preferably reduced to bivalentmanganese ions. In the second step, 90 mol % or more of the firstcomplex ions is preferably reduced, and 95 mol % or more is morepreferably reduced.

The reducing agent is not particularly limited as long as it can reducethe first complex ions. Specific examples of the reducing agent includehydrogen peroxide and oxalic acid.

Of these, hydrogen peroxide is preferable, because it can reduce thefirst complex ions with little adverse effect on the fluoride particles,like dissolving the fluoride particles, and it eventually decomposesinto water and oxygen, and thus can be advantageously used in theproduction process imposing less environmental burden.

The amount of the reducing agent is not particularly limited. The amountof the reducing agent can be suitably selected depending, for example,on the content of the first complex ions in the dispersed substance,preferably in such a manner that the concentration of hydrogen fluoridein the dispersed substance is not substantially affected. The specificamount of the reducing agent is preferably 3 equivalent % or more, andmore preferably 5 equivalent % or more relative to the content of thefirst complex ions that are contained in the dispersed substance but notin the fluoride particles in the dispersed substance.

Here, one equivalent means the number of moles of the reducing agentthat is required to reduce 1 mole of the first complex ions intodivalent manganese ions.

The second step may include, after a reducing agent is added to thedispersed substance, the step of mixing them. The mixing means formixing the dispersed substance and the reducing agent may be suitablyselected from the common mixing means depending, for example, on thereaction container.

The temperature in the second step is not particularly limited. Thereducing agent may be added at a temperature in the range of, forexample, 15 to 40° C., and preferably at a temperature in the range of23 to 28° C.

The atmosphere in the second step is not particularly limited. Thereducing agent may be added in the ordinary atmosphere, or in an inertgas atmosphere, such as nitrogen gas.

The reaction time in the second step is not particularly limited, andis, for example, 1 min to 30 min, and more preferably 3 min to 15 min.

Third Step

In the third step, a fluoride fluorescent material is obtained bycontacting, in the presence of hydrogen fluoride, the second complexions, at least one cation selected from the group consisting ofpotassium (K⁺), lithium (Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium(Cs⁺), and ammonium (NH₄ ⁺) to the fluoride particles in the dispersedsubstance to which a reducing agent is added. Contacting the fluorideparticles with the second complex ions and at least one cation selectedfrom the group consisting of potassium (K⁺), lithium (Li⁺), sodium(Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺), in thepresence of hydrogen fluoride, causes precipitation of, for example, afluoride containing at least one element selected from the groupconsisting of elements from Group 4 of the periodic table and elementsfrom Group 14 of the periodic table that are contained in the secondcomplex ions and at least one cation selected from the group consistingof potassium (K⁺), lithium (Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium(Cs⁺), and ammonium (NH₄ ⁺) on the surfaces of the fluoride particles togive a desired red-light fluorescent material.

The third step may be performed separately after the second step, or maybe performed after the start and before the completion of the secondstep, or the third step may be performed partly concurrently with thesecond step.

Because the red-light fluorescent material obtained in the third step isproduced by contacting fluoride particles represented by the formula (I)with the second complex ions and at least one cation selected from thegroup consisting of potassium (K⁺), lithium (Li⁺), sodium (Na⁺),rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺), the resultantred-light fluorescent material includes a surface region having a lowerMn⁴⁺ concentration than the inner region. The surface region preferablyhas a composition represented by the following formula (II):K₂[M_(1-y)Mn⁴⁺ _(y)F₆]  (II)wherein M is at least one element selected from the group consisting ofelements from Group 4 of the periodic table and elements from Group 14of the periodic table, and y satisfies 0<y<x.

The values of x and y are not particularly limited as long as 0<y<x<0.2is satisfied. The value of y can be suitably selected depending, forexample, on the desired light emission properties and moistureresistance. The value of y can be controlled, for example, by adjustingthe amount of contact of the second complex ions and of at least onecation selected from the group consisting of potassium (K⁺), lithium(Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺)with fluoride particles in the third step.

The method of contacting fluoride particles in the dispersed substanceto which a reducing agent is added with the second complex ions and atleast one cation selected from the group consisting of potassium (K⁺),lithium (Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium(NH₄ ⁺) in the third step is not particularly limited. Mixing, forexample, a dispersed substance containing a reducing agent with at leastone of a solution containing at least one cation selected from the groupconsisting of potassium (K⁺), lithium (Li⁺), sodium (Na⁺), rubidium(Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺), and a solution containing thesecond complex ions is preferable. Mixing a dispersed substancecontaining a reducing agent with at least one of the second solution andthe third solution is more preferable, and mixing a dispersed substancecontaining a reducing agent with the second solution and the thirdsolution is more preferable. Here, the preferred modes of the secondsolution and the third solution are as follows.

When a dispersed substance is mixed with at least one of a solutioncontaining at least one cation selected from the group consisting ofpotassium (K⁺), lithium (Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium(Cs⁺), and ammonium (NH₄ ⁺), and a solution containing the secondcomplex ions, the other ions not contained in the solution to be mixed,specifically, either the solution containing at least one cationselected from the group consisting of potassium (K⁺), lithium (Li⁺),sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺) or thesolution containing the second complex ions, would suffice if such otherions are contained in the dispersed substance in an amount necessary forthe third step.

The second solution and the third solution of the third step may havethe same or different compositions as or from the second solution andthe third solutions of the first step, respectively.

When the third step includes mixing a dispersed substance containing areducing agent with at least one of the solution containing at least onecation selected from the group consisting of potassium (K⁺), lithium(Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺),and the solution containing the second complex ions, the mixing meansmay be suitably selected from the common mixing means depending, forexample, on the reaction container.

The temperature in the third step is not particularly limited. The stepmay be performed, for example, at a temperature in the range of 15 to40° C., and preferably in the range of 23 to 28° C.

The atmosphere in the third step is not particularly limited. The stepmay be performed in the ordinary atmosphere or in an inert gasatmosphere, such as nitrogen gas.

The reaction time in the second step is not particularly limited, andis, for example, 1 min to 60 min, and more preferably 5 min to 30 min.

When the third step includes mixing a dispersed substance containing areducing agent with at least one of a solution containing at least onecation selected from the group consisting of potassium (K⁺), lithium(Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), and ammonium (NH₄ ⁺),and a solution containing the second complex ions, the amount of thesolution containing the second complex ions and the solution containingat least one cation selected from the group consisting of potassium(K⁺), lithium (Li⁺), sodium (Na⁺), rubidium (Rb⁺), cesium (Cs⁺), andammonium (NH₄ ⁺) relative to fluoride particles in the dispersedsubstance containing a reducing agent may be appropriately selected,depending, for example, on the intended light emission properties andmoisture resistance of the fluoride fluorescent materials. The amount ofthe second complex ions relative to fluoride particles may be, forexample, 1 mol % to 40 mol %, and preferably 5 mol % to 30 mol %.

Additional Step

The process for producing a red-light fluorescent material may includean additional step, as necessary. The red-light fluorescent materialproduced in the third step, for example, can be collected bysolid-liquid separation through filtration, for example. The red-lightfluorescent material may be washed with a solvent such as ethanol,isopropyl alcohol, water, and acetone. The red-light fluorescentmaterial may be then dried, for example at 50° C. or more, preferably55° C. or more, more preferably 60° C. or more, and, for example, at110° C. or less, preferably 100° C. or less, and more preferably 90° C.or less. The drying time is not particularly limited as long as waterremaining on the red-light fluorescent material is vaporized, and it is10 hours, for example.

Another Fluorescent Material

The light emitting device preferably includes another fluorescentmaterial in addition to the red-light fluorescent material. Anyfluorescent material may be used that absorbs light from the lightsource and changes the wavelength of the light to a differentwavelength. Like the red-light fluorescent material, another fluorescentmaterial is also contained in the encapsulation resin that constitutesthe light emitting device.

Another fluorescent material may be preferably at least one selectedfrom the group consisting of, for example, nitride fluorescentmaterials, oxynitride fluorescent materials, and sialon fluorescentmaterials that are mainly activated by a lanthanoid element such as Euand Ce; alkaline-earth halogenapatite fluorescent materials,alkaline-earth metal borate halogen fluorescent materials,alkaline-earth metal aluminate fluorescent materials, alkaline-earthsilicates, alkaline-earth sulfides, alkaline-earth thiogallates,alkaline-earth silicon nitrides, and germanate salts that are mainlyactivated by a lanthanoid element, such as Eu or a transition metalelement, such as Mn; rare-earth aluminate and rare-earth silicate thatare mainly activated by a lanthanoid element such as Ce; and at leastone selected from an organic compound and an organic complex mainlyactivated by a lanthanoid element such as Eu.

Specific examples of another fluorescent materials include(Ca,Sr,Ba)₂SiO₄:Eu, (Y,Gd,Lu)₃(Ga,Al)₅O₁₂:Ce,(Si,Al)₆(O,N)₈:Eu(β-sialon), (Ba,Sr,Ca)Ga₂S₄:Eu, (Ca,Sr)₂Si₅N₈:Eu,CaAlSiN₃:Eu, (Ca,Sr)AlSiN₃:Eu, (Ca,Sr,Ba,Zn)₈MgSi₄O₁₆:Eu,(Ca,Sr,Ba,Zn)₈MgSi₄O₁₆(F,Cl,Br,I)₂:Eu, La₃Si₆N₁₁:Ce, Ca₃Sc₂Si₃O₁₂:Ce,CaSc₂O₄:Ce, and Ba₃Si₆O₁₂N₂:Eu.

By including additional fluorescent materials, light emitting deviceswith a wide variety of color tones can be provided.

When such additional fluorescent materials are included in the lightemitting device, the amount of such additional fluorescent materialscontained are not particularly limited and may be adjusted so as toachieve the desired light-emitting properties.

When the light emitting device includes additional fluorescentmaterials, it preferably includes a green to yellow-light emittingfluorescent material, and more preferably a green to yellow-lightemitting fluorescent material that absorb light in the wavelength rangeof 380 nm to 485 nm, and emit light having a wavelength range of 495 nmto 590 nm. The light emitting devices including a green to yellow-lightemitting fluorescent material is more suitable for use in liquid crystaldisplays. When the light emitting device includes a plurality of lightemitting elements, for example, a light emitting element that emits bluelight and a light emitting element that emits green to yellow light, theemission colors of green to yellow light can be obtained by the lightemitting elements, and thus a green to yellow-light emitting fluorescentmaterial is not an essential constituent for the light emitting deviceaccording to this embodiment.

Such a green to yellow-light emitting fluorescent material is preferablyat least one fluorescent material selected from the group consisting ofβ-sialon represented by the compositional formula (Si,Al)₆(O,N)₈: Eu;halosilicate represented by the compositional formula(Ca,Sr,Ba,Zn)₈MgSi₄O₁₆(F,Cl,Br,I)₂: Eu; alkaline-earth thiogallaterepresented by the compositional formula (Ba,Sr,Ca)Ga₂S₄:Eu; and arare-earth aluminate fluorescent material represented by thecompositional formula (Y,Lu)₃(Al,Ga)₅O₁₂:Ce. Such a green toyellow-light emitting fluorescent material may be used alone or incombination.

Content of Fluorescent Material in Encapsulation Material (ResinComposition)

The content of the fluorescent materials in an encapsulation material(resin composition) is preferably 1 to 200 mass parts relative to 100mass parts of the resin, more preferably 5 to 195 mass parts, still morepreferably 10 to 190 mass parts, and particularly preferably 15 to 185mass parts, and most preferably 20 to 180 mass parts. With the contentof the fluorescent materials within this range in a resin composition,the light emitting element can be fully covered, the wavelength of thelight emitted from the light emitting element can be efficientlyconverted by the fluorescent materials, and the light emitting devicecan effectively emit light. With the content of the fluorescentmaterials in the resin composition being 1 to 200 mass parts relative to100 mass parts of the resin, an encapsulation member that containsparticles of a red-light fluorescent material alone or of a red-lightfluorescent material and a non-red-light fluorescent material, and thatcovers the light emitting device with a uniform thickness can be formed.

Mass ratio of green to yellow-light emitting fluorescent material tored-light fluorescent material

When the fluorescent materials includes a red-light fluorescent materialand a green to yellow-light emitting fluorescent material, the massratio of the green to yellow-light emitting fluorescent material to thered-light fluorescent material (the green to yellow-light emittingfluorescent material: the red-light fluorescent material) is preferably5:95 to 95:5, more preferably 10:90 to 90:10, still more preferably20:80 to 80:20, and particularly preferably 25:75 to 75:25. When thegreen to yellow-light emitting fluorescent material includes a red-lightfluorescent material within this range, the red-light fluorescentmaterial contains a fluoride having a chemical composition representedby the formula (I), and thus has a narrow half bandwidth of the emissionspectrum, with a large gap from the peak of the emission spectrum thatemits green to yellow. This enables the light emitting device to absorbthe light from light emitting elements and to emit light with a highcolor gamut and high emission output.

Other Materials

The encapsulation material (resin composition) that constitutesencapsulation member contains at least a resin, a fluorescent material,and nanoparticles, and a filler as necessary. The encapsulation materialmay further contain, for example, a curing agent for curing a resin.Additionally, the encapsulation material may also contain a dye and apigment, for example. The material may also contain pores (voids) fordispersing light to the extent not to cause adverse effects.

Process for Producing Encapsulation Material (Resin Composition)

The process for producing an encapsulation material (resin composition)is not particularly limited, and there is no limitation to the mixingorders of the materials.

The resin composition may be produced by mixing predetermined amounts ofmaterials at the same time, or mixing predetermined amounts of materialssequentially. The encapsulation material (resin composition) ispreferably produced by introducing a resin, a fluorescent material,nanoparticles, a filler, and the other materials into a container inthis order, and mixing them.

FIG. 2 is a view illustrating a schematic structure of the lightemitting device 100 according to the second embodiment. As shown in FIG.2, the light emitting device 100 includes a package 30, a light emittingelement 40 disposed on the package 30, and an encapsulation member 90that covers the light emitting element 40. The encapsulation member 90includes a first section 101 that contains a red-light fluorescentmaterial 70 and a non-red-light fluorescent material 80, and that coversthe light emitting element 40, and a second section 102 that is providedon the first section 101 and that contains substantially no fluorescentmaterials. The package 30 has side walls that define a recess 20. Thepackage 30 integrally includes, at its bottom, a first lead 50 and asecond lead 60. The light emitting device 100 according to the secondembodiment is the same as the light emitting device 1 according to thefirst embodiment, except that the light emitting device 100 includes theencapsulation member 90 that includes the first section 101 and thesecond section 102. The encapsulation member 90 includes nanoparticles130. The first section 101 and the second section 102 both containnanoparticles 130.

In FIG. 2, the red-light fluorescent material 70, the non-red-lightfluorescent material 80, and nanoparticles 130 are not to scale, merelyschematically illustrating the red-light fluorescent material 70, thenon-red-light fluorescent material 80, and nanoparticles 130.

In the present specification, the second section “contains substantiallyno fluorescent materials” in the second section indicates that there areessentially no fluorescent materials in the second section, and that thecontent of the fluorescent material is 1 mass % or less relative to thetotal mass of the second section, although this is not limitative.

First Section and Second Section

The first section 101 and the second section 102 constitute theencapsulation member 90 that encapsulates the light emitting element 40.The first section 101 and the second section 102 are composed of theabove-described resin composition, which is the encapsulation material.The first section 101 and the second section 102 are formed as follows:The resin composition as an encapsulation material is injected into therecess 20 of the package 30, in which the light emitting element 40 isdisposed. The particles of the red-light fluorescent material 70 and ofthe non-red-light fluorescent material 80 are then centrifugally settledon the side of the light emitting element 40, and subsequently the resinis cured to cover the light emitting element 40, thereby forming thefirst section 101, which contains the red-light fluorescent material 70,the non-red-light fluorescent material 80, the resin, and thenanoparticles, and the second section 102, which is provided on thefirst section 101, and contains the resin, the nanoparticles, andsubstantially none of the red-light fluorescent material 70 and thenon-red-light fluorescent material 80. The red-light fluorescentmaterial 70 is Mn⁴⁺ activated, has a chemical composition represented bythe formula (I), and includes a surface region having a lower Mn⁴⁺concentration than the inner region of the fluorescent material. Thenon-red-light fluorescent material 80 is not the above-describedred-light fluorescent material but a green to yellow-light emittingfluorescent material. After centrifugal settling, the nanoparticles 130are substantially uniformly dispersed both in the first section 101 andin the second section 102. Here, the state where the nanoparticles aresubstantially uniformly dispersed in the first section and/or the secondsection indicates that in any cross-section observed of the firstsection and/or the second section, the primary particle size of thenanoparticles that exist there is within a given range, that thedifference between the number of the nanoparticles that exist in a givenarea and the average number of such nanoparticles is limited to apredetermined range, and that the nanoparticles are not unevenly orlocally distributed in any cross-section. For example, if thenanoparticles are not unevenly dispersed in multiple locations, underelectron microscopy observation at any magnification within any visualfield range, in any cross section of the nanoparticles in the firstsection and/or the second section, then the nanoparticles can be said tobe substantially uniformly dispersed.

The first section 101 contains particles of the red-light fluorescentmaterial 70 that have a chemical composition represented by the formula(I), and that have a surface region with a lower tetravalent manganeseion concentration than the inner region of the fluorescent material. Theparticles of the fluorescent material, including the particles of thered-light fluorescent material 70, are fully dispersed in the resincomposition, and then accumulated on the light emitting element due tothe centrifugal settling but not being too dense, whereby the resincomposition is separated into two layers, the first section 101 and thesecond section 102.

Since the first section 101 and the second section 102 are made of thesame resin, losses in emission output can be reduced. Furthermore, sincethe light emitting element 40 is covered with the red-light fluorescentmaterial 70 and the non-red-light fluorescent material 80, thewavelength of the light emitted from the light emitting element can beefficiently converted by the fluorescent materials, and the light can beemitted efficiently.

In a conventional tetravalent manganese ion (Mn⁴⁺)-activated red-lightfluorescent materials, the tetravalent manganese ion in the red-lightfluorescent material may react with water in the air on the particlesurface to generate manganese dioxide, which discolors the particlesurface, resulting in chromaticity change and reduction in emissionoutput.

In the light emitting device 100, the light emitting surface is composedof the second section 102, and water in the air that enters through, forexample, the interface between the air and the package 30 is blocked bythe second section 102. The second section 102 blocks water in the airfrom reaching the red-light fluorescent material 70 contained in thefirst section 101. Thus, the reaction of water with the tetravalentmanganese ion contained in the tetravalent manganese ion(Mn⁴⁺)-activated red-light fluorescent material can be reduced, anddiscoloration of the particle surface due to the generation of manganesedioxide can be reduced. Hence, the light emitting device according toone mode of this disclosure can reduce losses in emission output andgeneration of chromaticity change, demonstrating full moistureresistance in a long-term reliability test.

In the light emitting device 100, the red-light fluorescent materialparticles are separated from the uppermost top surface of theencapsulation member by the second section 102. Thus the water in theair is unlikely to reach the red-light fluorescent material particlescontained in the first section 101. This reduces the deterioration ofthe red-light fluorescent material. In a case where the red-lightfluorescent material reacts with water, Mn⁴⁺ and F contained in thered-light fluorescent material would elute, and the resin that forms thefirst section 101 and the second section 102 would become discolored.The above-described configuration can prevent or reduce the red-lightfluorescent material from reacting with water, and also can prevent orreduce discoloration of the resin that forms the first section 101 andthe second section 102.

The second section 102 preferably has a thickness, immediately above thelight emitting element, of 1/10 or more of the entire thickness of theencapsulation member. With the thickness of the second section 102,immediately above the light emitting element, being 1/10 or more of theentire thickness of the encapsulation member, the above-describedeffects can be achieved, and the light converted by the fluorescentmaterial can be efficiently released to the outside of the lightemitting device.

The second section 102 preferably has a thickness, immediately above thelight emitting element, of ¼ or more of the entire thickness of theencapsulation member. With the thickness of the second section 102,immediately above the light emitting element, being ¼ or more of theentire thickness of the encapsulation member, water in the air isblocked by the second section 102 and is unlikely to reach thefluorescent material particles that are contained in the first section101, and the reaction between water and the tetravalent manganese ionthat is contained in the tetravalent manganese ion (Mn⁴⁺)-activatedred-light fluorescent material 70 in the first section 101 is preventedor reduced, thereby efficiently preventing or reducing discoloration ofthe particle surface due to the generation of manganese dioxide.

Content of the Fluorescent Material in the First Section

The content of the fluorescent material in the first section 101 ispreferably 20 to 400 mass parts, more preferably 25 to 380 mass parts,still more preferably 30 to 350 mass parts, and particularly preferably35 to 300 mass parts relative to 100 mass parts of the resin in thefirst section 101. With the content of the fluorescent material in thefirst section 101 being in the above-described range, the light emittingelement can be covered with the fluorescent material that has a uniformthickness. Thus, the wavelength of the light from the light emittingelement can be efficiently converted with the fluorescent material.

Process for Producing of the Light Emitting Devices (First Embodiment)

The process for producing the light emitting device according to thisdisclosure includes, as a first embodiment, the steps of preparing apackage having side walls that define a recess; arranging the lightemitting element in the recess; injecting the above-described resincomposition into the recess; and covering the light emitting elementwith the resin composition, and curing the resin composition to form anencapsulation member.

Hereinbelow, the process for producing the light emitting device will beexplained referring to FIG. 1.

Step of Preparing a Package

The package 3 will be prepared. According to the first embodiment, thepackage 3 has side walls. The package 3 has a first lead 5 and a secondlead 6 that integrally constitute the bottom of the recess 2.

Step of Arranging the Light Emitting Element

The light emitting element 4 is arranged on and bonded by die bondingwith the first lead 5 that constitutes the bottom of the recess 2 of thepackage 3. The negative and positive electrodes (not shown) of the lightemitting element 4 are bonded with the first lead 5 and the second lead6 using wires 11 and 12, respectively. The production process of thelight emitting device according to this disclosure may further include,as necessary, the step of covering the light emitting element 4, thefirst lead 5, the second lead 6, and the wires 11 and 12 with aninsulating member (not shown). The insulating member is preferablyformed, by sputtering or deposition, as a film (layer) of an inorganiccompound on the first lead 5 and the second lead 6 (conductive member),the wires 11 and 12, and the light emitting element 4. The insulatingmember is more preferably formed as a film (layer) by Atomic LayerDeposition (ALD).

Covering step Next, an encapsulation material containing a resin (notshown), nanoparticles 13, a filler (not shown) as necessary, and theparticles of the red-light fluorescent material 7, and the particles ofthe non-red-light fluorescent material 8 are injected into the recess 2of the package 3, and the light emitting element 4 arranged in thepackage 3 is covered with the encapsulation material. Specifically, theencapsulation material (resin composition) is filled in the recess 2 andthe light emitting element 4 is covered. The resin composition ispreferably injected into a plurality of recesses 2 of a plurality ofpackages 3 using a syringe, for example. The resin composition maycontain other materials as necessary.

Curing Step

In the curing step, the resin composition that is filled in the recess 2of the package 3 undergoes curing treatment. This step completes a lightemitting device including the encapsulation member 9, which is formedfrom the above-described resin composition and covers the light emittingelement 4. The curing method of the resin is not particularly limited,and may be suitably selected according to the resin used. Thenanoparticles 13 contained in the resin composition are substantiallyuniformly dispersed in the encapsulation member 9.

Process for Producing the Light Emitting Device (Second Embodiment)

The second embodiment according to the process for producing the lightemitting device of this disclosure will be explained.

In the process for producing the light emitting device according to thesecond embodiment, the steps of preparing a package having side wallsthat define a recess; and arranging the light emitting element in therecess are the same as those in the first embodiment.

The second embodiment relating to a process for producing a lightemitting device includes, before the curing step, which was described inthe first embodiment, the step of centrifugally settling the particlesof a fluorescent material on the side that the light emitting element isarranged in the encapsulation material (resin composition), covering thelight emitting element. Providing the step of centrifugal settlingbefore curing the resin enables forming of an encapsulation member thatincludes a first section that contains resin, the nanoparticles, and theparticles of the fluorescent material and that covers the light emittingelement, and a second section that is provided on the first section andcontains resin, the nanoparticles, and substantially no fluorescentmaterial. Hereinbelow, the step of centrifugally settling the particlesof the fluorescent material, and the final step of curing the resincomposition to form an encapsulation member will be described, referringto FIG. 2.

Step of Centrifugally Settling Fluorescent Material

As shown in FIG. 2, an encapsulation material (resin composition) isinjected into the recess 20, which is defined by the side walls of thepackage 30, to fill the recess 20 with the encapsulation material (resincomposition). Due to the centrifugal force forcibly applied to thepackage 30 that is filled with the encapsulation material (resincomposition), the particles of the red-light fluorescent material 70 andof the non-red-light fluorescent material 80 in the resin compositionare centrifugally settled in such a manner to cover the light emittingelement 40. Curing the resin thereafter provides an encapsulation member90, which is formed from the resin composition, including a firstsection 101 that contains the particles of the fluorescent materials andthat covers the light emitting element, and a second section 102 that isprovided on the first section 101 and that contains substantially nofluorescent materials. In the centrifugal settling step, the package 30including the recess 20 that is filled with the resin composition, ispreferably put into a magazine and rotated until the particles of thefluorescent materials fully settle due to centrifugal force.

Centrifugal settling of the fluorescent material is effected by causingthe direction of the resultant force of the centrifugal force andgravity to conform to the direction vertical to the bottom surface ofthe package where the light emitting element is arranged. Here, thebottom of the package includes the first lead 50 and the second lead 60on which the light emitting element is disposed. By causing thedirection of the resultant force of the centrifugal force and gravity toconform to the direction vertical to the bottom surface of the package,the particles of the fluorescent material dispersed in the resincomposition settle with a uniform thickness on the light emittingelement and the bottom surface of the package, thereby forming the firstsection 101 with a uniform thickness.

The centrifugal settling of the particles of the fluorescent material ispreferably conducted such that the second section 102 has a thickness,immediately above the light emitting element 40, of 1/10 of the entirethickness of the resin composition. The thickness of the second section102 can be controlled by adjusting the conditions of the centrifugalsettling, the type and the amount of the resin and the type and theamount of the fluorescent material in the encapsulation material asappropriate. By setting the conditions, the fluorescent material can becentrifugally settled so that the second section has a thickness of 1/10or more of the entire thickness of the encapsulation material (resincomposition).

The centrifugal settling of the fluorescent material is preferablyconducted such that the second section 102 has a thickness, immediatelyabove the light emitting element 40, of ¼ or more of the entirethickness of the encapsulation material. By adjusting the conditions ofthe centrifugal settling, the type and the amount of the resin and thetype and the amount of the fluorescent material in the encapsulationmaterial (the resin composition) as appropriate, the particles of thefluorescent material can be centrifugally settled so that the secondsection 102 has a thickness of ¼ or more of the entire thickness of theencapsulation material (resin composition).

The nanoparticles 130 contained in the resin composition aresubstantially uniformly dispersed in the first section 101, irrespectiveof the centrifugal settling of the fluorescent material, and aresubstantially uniformly dispersed also in the second section 102.

Curing Step

After the centrifugal settling of the fluorescent material, the resin iscured. With the formation of a curing product of the encapsulationmaterial (resin composition), which is injected into the recess 20 ofthe package 30, a light emitting device 100 that includes anencapsulation member 90 is provided. The encapsulation member 90 iscomposed of the first section 101 that contains the red-lightfluorescent material 70 and the non-red-light fluorescent material 80,and that covers the light emitting element 40, and the second section102 that is provided on the first section 101 and that containssubstantially no red-light fluorescent material 70. The method of curingthe resin is not particularly limited, and may be suitably selecteddepending on the resin used.

Image Display Apparatus

An image display apparatus includes at least one light emitting devicedescribed above. The image display apparatus is not particularly limitedas long as it includes the light emitting device, and may beappropriately selected from conventional image display apparatuses. Animage display apparatus includes, in addition to the above-describedlight emitting device, a color filter member and an optical transmissioncontrol member, for example.

EXAMPLES

Hereinbelow, the present embodiment will be specifically described bymeans of Examples, but the present embodiment is not limited to thoseExamples.

Production Example 1 of Red-Light Fluorescent Material To have aninitial composition ratio as shown in Table 1, 21.66 g of K₂MnF₆ wasweighed and dissolved into 800 g of a 55 wt % aqueous solution of HF,and then 400 g of a 40 wt % aqueous solution of H₂SiF₆ was added toprepare solution A. Separately, 260.14 g of KHF₂ was weighed anddissolved into 450 g of a 55 wt % aqueous solution of HF to preparesolution B. Additionally, 200 g of a 40 wt % aqueous solution of H₂SiF₆was weighed to have solution C.

Next, solution B and solution C were simultaneously added dropwise tosolution A under stirring at room temperature (23 to 28° C.) toprecipitate fluorescent material crystals (fluoride particles). Thedropwise addition was once stopped when 75 wt % of the dropwise additionof solution B and solution C was each completed, as shown in Table 2(the first step).

As a reducing agent, 15 g of a 30% aqueous solution of H₂O₂ was weighedand added to solution A (the second step), and then dropwise addition ofsolution B and solution C was resumed (the third step). After completionof the dropwise addition of solution B and solution C, the resultantprecipitate was separated, washed with IPA (isopropyl alcohol), anddried at 70° C. for 10 hours to prepare a red-light fluorescent(K₂[Si_(0.97)Mn⁴⁺ _(0.03)F₆]) material 1 of Production Example 1. Thered-light fluorescent material 1 of Production Example 1 has a surfaceregion with a lower tetravalent manganese ion concentration than theinner region of the fluorescent material.

TABLE 1 Solution A Solution B Solution C Reducing Initial amount (g)Initial amount (g) Initial amount (g) agent (g) Initial composition 40%aqueous 55% aqueous 55% aqueous 40% aqueous 30% aqueous ratio (mol)solution solution solution solution solution K Si Mn F K₂MnF₆ of H₂SiF₆of HF KHF₂ of HF of H₂SiF₆ of H₂O₂ Production 2 0.95 0.05 6 21.66 400800 260.14 450 200 15 Example 1

TABLE 2 Percentage of dropwise addition before addition of reducingagent (%) Solution B Solution C Production 75 75 Example 1

Production Example 2 of Red-Light Fluorescent Material

The red-light fluorescent material 2 (K₂[Si_(0.97)Mn⁴⁺ _(0.03)F₆]) ofProduction Example 2 was prepared in the same manner as that ofProduction Example 1, except that the second step in Production Example1 of the red-light fluorescent material was omitted. The red-lightfluorescent material 2 of Production Example 2 lacks a surface regionhaving a lower Mn⁴⁺ concentration than the inner region.

Example 1 Production of Encapsulation Material (Resin Composition)

As the red-light fluorescent material, the red-light fluorescentmaterial of Production Example 1 was used. As the green to yellow-lightemitting fluorescent material, (Si,Al)₆(O,N)₈:Eu(β-sialon) was used. Thegreen to yellow-light emitting fluorescent material and the red-lightfluorescent material were formulated so that the mass ratio of the greento yellow-light emitting fluorescent material and the red-lightfluorescent material was 27:73 (the green to yellow-light emittingfluorescent material: the red-light fluorescent material). As the resin,phenyl silicone (Dow Corning (Registered Trademark: OE-6630)) was used.As the nanoparticles, silica nanoparticles (silicon oxide nanoparticles)having a number average primary particle size of 12 nm, as determined byTEM, were used. As the filler, silica (silicon oxide) having a volumeaverage particle size (median size: d50) of 11 μm, as determined by alaser differential scattering particle size analyzer (MASTER SIZER 2000by MALVERN), was used. The formulation of the components is as follows.

A container for stirring was charged with a resin and fluorescentmaterials (a red-light fluorescent material and a green to yellow-lightemitting fluorescent material), and then with silica nanoparticles and afiller. The mixture was stirred for about 5 minutes to obtain anencapsulation material (resin composition) 1.

Resin Composition 1

Phenyl silicone resin material (Agent A) 20 mass parts Red-lightfluorescent material 28 μm, 31.57 mass parts (Production Example 1),average particle size: (43.25 mass parts × 0.73) Green to yellow-lightemitting fluorescent 15 μm, 11.68 mass parts material (β-sialon),average particle size: (43.25 mass parts × 0.27) Silica nanoparticles(silica, the number 0.4 mass parts average primary particle size: 12 nm)Filler (silica, volume average secondary 5 mass parts particle size: 11μm) Phenyl silicone resin material (Agent B) 80 mass parts

Process for Producing the Light Emitting Device

A package having side walls that define a recess was prepared. Into therecess, a light emitting element was disposed, and then resincomposition 1 was injected into the recess of the package using asyringe. A light emitting element having an emission peak wavelength ofabout 445 nm was used. The light emitting element was covered with resincomposition 1 that was injected into the recess of the package. Theresin composition was then cured to form an encapsulation member 9, anda light emitting device of Example 1 was completed. In the encapsulationmember 9, silica nanoparticles were substantially uniformly dispersed.

Comparative Example 1

Resin composition 2 was produced in the same manner as resin composition1 except that a red-light fluorescent material 2, which differs from thered-light fluorescent material used in Example 1, was used. Thisred-light fluorescent material 2 is the red-light fluorescent materialin Production Example 2 and has no surface region that has a lower Mn⁴⁺concentration than the inner region of the fluorescent material. Thelight emitting device of Comparative Example 1 was produced in the samemanner as Example 1, except that resin composition 2 was used.

Comparative Example 2

Resin composition 3 was produced in the same manner as resin composition1, except that the resin composition contains no silica nanoparticlesnor a filler. The light emitting device of Comparative Example 2 wasproduced in the same manner as Example 1, except that resin composition3 was used.

Comparative Example 3

Resin composition 4 was produced in the same manner as resin composition2 except that red-light fluorescent material 2, which differs from thered-light fluorescent material used in Example 1, was used and that theresin composition contains no silica nanoparticles nor a filler. Thelight emitting device of Comparative Example 3 was produced in the samemanner as Example 1, except that resin composition 4 was used.

PCT (Pressure Cooker Test)

The light emitting devices of Example 1 and Comparative Examples 1 to 3were subjected to a pressure cooker test (PCT) under the conditions of121° C., 100% humidity, 2 atmospheric pressure (atm), and 100 hours. Theresults are shown in Table 3 and FIG. 3.

Table 3 shows whether the red-light fluorescent material has theabove-defined surface region or not, whether the silica nanoparticlesare contained or not, whether the encapsulation member has theabove-defined first section and the second section, and whetherdiscoloration after 100 hour-PCT test is observed for the light emittingdevices of Example 1 and Comparative Examples 1 to 3.

As for the surface region, “Yes” indicates that the red-lightfluorescent material in question has a surface region with a lowertetravalent manganese ion concentration than the inner region of thefluorescent material, and “No” indicates that the red-light fluorescentmaterial has no such a surface region. As for silica nanoparticles,“Yes” indicates that silica nanoparticles are contained in the resincomposition, which constitutes the encapsulation member of the lightemitting device in question, and “No” indicates that no silicananoparticles are contained. As for the first section and the secondsection, “Yes” indicates that the encapsulation member of the lightemitting device in question has the above-defined first section and thesecond section, and “No” indicates that the encapsulation member has nofirst and second sections.

The presence of discoloration after the PCT test was evaluated accordingto the following scale.

A: No discoloration

B: Slight discoloration

C: Noticeable discoloration

TABLE 3 Presence Presence Results of of Surface Presence of First 100hour- region in of section PCT test Red-light Silica and (presencefluorescent nano- Second of material particles section discoloration)Example 1 Yes Yes No A Comparative No Yes No B Example 1 Comparative YesNo No B Example 2 Comparative No No No C Example 3

FIG. 3A is a photograph of the light emitting device of Example 1, takenafter 100 hours of PCT.

As shown in FIG. 3A, no discoloration was observed on the surface of thelight emitting device of Example 1 after 100 hours of PCT. The resultsshown in FIG. 3A indicates that the light emitting device of Example 1is superior in durability.

FIG. 3B shows a photograph of the light emitting device of ComparativeExample 1, taken after 100 hours of PCT.

As shown in FIG. 3B, slight discoloration was observed on the surface ofthe light emitting device of Comparative Example 1 after 100 hours ofPCT. It is inferred that the reaction between the tetravalent manganeseions and water on the surfaces of the particles of the red-lightfluorescent material, which has no surface region, was not prevented orreduced, unlike Example 1, allowing generation of manganese dioxide onthe surfaces of the particles of the red-light fluorescent material.

FIG. 3C is a photograph of the light emitting device of ComparativeExample 2, taken after 100 hours of PCT.

As shown in FIG. 3C, slight discoloration was observed on the surface ofthe light emitting device of Comparative Example 2 after 100 hours ofPCT. It is inferred that since the resin composition contains no silicananoparticles, the reaction between tetravalent manganese ions and wateron the surfaces of the particles of the red-light fluorescent materialwas not prevented or reduced, unlike Example 1, allowing generation ofmanganese dioxide on the surfaces of the particles of the red-lightfluorescent material.

FIG. 3D is a photograph of the light emitting device of ComparativeExample 3, taken after 100 hours of PCT.

As shown in FIG. 3D, discoloration was observed on the surface of thelight emitting device of Comparative Example 3 after 100 hours of PCT.It is inferred that the reaction between tetravalent manganese ions andwater on the surfaces of the particles of the red-light fluorescentmaterial that contains no silica nanoparticles in the resin compositionand that has no surface region with a lower Mn⁴⁺ concentration than theinner region of the fluorescent material, was less reduced than inComparative Examples 1 and 2, allowing generation of manganese dioxideon the surfaces of the particles of the red-light fluorescent material.

Example 2 Process for Producing the Light Emitting Device

Referring to FIG. 2, a package 30 having side walls that define a recess20 was prepared. Into the recess 20, a light emitting element 40 wasdisposed, and then resin composition 1 was injected into the recess 20of the package 30, using a syringe. As the light emitting element 40, alight emitting element having an emission peak wavelength of about 445nm was used.

The package 30 including the recess 20 that is filled with resincomposition 1 was then put into a magazine and fully rotated in acentrifuge to allow the particles of the red-light fluorescent material70 and the non-red-light fluorescent material 80 contained in resincomposition 1 to settle under the centrifugal force. By curing the resincomposition 1 that was injected into the recess 20 of the package 30, anencapsulation member 90 including a first section 101 that contains thered-light fluorescent material 70 and the non-red-light fluorescentmaterial 80, and that covers the light emitting element 40, and a secondsection 102 that is provided on the first section 101 and containssubstantially no fluorescent materials, was formed. Before curing, thesecond section 102 had a thickness, immediately above the light emittingelement 40, of 1/10 or more of the entire thickness of the encapsulationmaterial (resin composition 1). After curing, immediately above thelight emitting element 40, specifically, the entire thickness of theencapsulation member 90 is 410 μm, the first section 101 had a thicknessof 150 μm, and the second section 102 had a thickness of 260 μm.

In the step of settling the fluorescent materials under centrifugalforce, centrifugal settling of the fluorescent materials was effected bycausing the direction of the resultant force of the centrifugal forceand gravity to conform to the direction vertical to the bottom surfaceof the package where the light emitting element is arranged.

Subsequently, the resin composition 1 was cured to form an encapsulationmember 90 including the first section 101 that contains the red-lightfluorescent material 70 and the non-red-light fluorescent material 80,and that covers the light emitting element 40, and the second section102 that is provided on the first section 101, and that containssubstantially no fluorescent material, and a light emitting device ofExample 2 was completed.

FIG. 4 is a 20× photograph of a cross-section of the light emittingdevice of Example 2, which was taken by a fluorescent microscope. Asshown in FIG. 4, it was confirmed that the first section 101 thatcontains the red-light fluorescent material 70 and the non-red-lightfluorescent material 80, and that covers the light emitting element 40,and the second section 102 that is provided on the first section 101 andthat contains substantially no red-light fluorescent material 70 wereformed in the light emitting device 100 of Example 2. Silicananoparticles were substantially uniformly dispersed in the firstsection 101, and were also substantially uniformly dispersed in thesecond section 102.

Comparative Example 4

Resin composition 2 was obtained in the same manner as resin composition1 except that red-light fluorescent material 2, which differs from thered-light fluorescent material that was used in Example 1, was used inthe resin composition. The red-light fluorescent material 2 has nosurface region that has a lower Mn⁴⁺ concentration than the inner regionof the fluorescent material. The light emitting device of ComparativeExample 4 was produced in the same manner as Example 2, except thatresin composition 2 was used.

Comparative Example 5

Resin composition 5 was obtained in the same manner as resin composition1, except that the resin composition contains no silica nanoparticles.The light emitting device of Comparative Example 5 was produced in thesame manner as Example 2, except that resin composition 5 was used.

Comparative Example 6

Resin composition 6 was obtained in the same manner as resin composition2 except that the resin composition contains no silica nanoparticles andcontains a red-light fluorescent material 2, which differs from thered-light fluorescent material of Example 1. The red-light fluorescentmaterial 2 has no surface region that has a lower Mn⁴⁺ concentrationthan the inner region of the fluorescent material. The light emittingdevice of Comparative Example 6 was produced in the same manner asExample 2, except that the resin composition 6 was used.

Pressure Cooker Test (PCT)

The light emitting devices of Example 2 and Comparative Examples 4 to 6underwent a PCT under the conditions of 121° C., 100% humidity, 2atmospheric pressure (atm), and 100 hours. The results are shown inTable 4 and FIG. 5.

Table 4 shows whether the red-light fluorescent material has theabove-defined surface region or not, whether the silica nanoparticlesare contained or not, whether the encapsulation member has theabove-defined first section and the second section, and whetherdiscoloration after 100 hour-PCT test is observed for the light emittingdevices of Example 2 and Comparative Examples 4 to 6. As for the surfaceregion, “Yes” indicates that the red-light fluorescent material inquestion has a surface region with a lower tetravalent manganese ionconcentration than the inner region of the fluorescent material, and“No” indicates that the red-light fluorescent material has no such asurface region. As for silica nanoparticles, “Yes” indicates that silicananoparticles are contained in the resin composition, which constitutesthe encapsulation member of the light emitting device in question, and“No” indicates that no silica nanoparticles are contained. As for thefirst section and the second section, “Yes” indicates that theencapsulation member of the light emitting device in question has afirst section and a second section, and “No” indicates that theencapsulation member has no first and second sections.

The presence of discoloration after the PCT test was evaluated accordingto the following scale.

A: No discoloration

B: Slight discoloration

C: Noticeable discoloration

TABLE 4 Presence of the Presence Surface region Presence of FirstPresence of in the of section Discoloration red-light Silica and afterfluorescent nano- Second the material particles section PCT test Example2 Yes Yes Yes A Comparative No Yes Yes A Example 4 Comparative Yes NoYes A Example 5 Comparative No No Yes A Example 6

FIG. 5A is a photograph of the light emitting device of Example 2, takenafter 100 hours of PCT.

As shown in FIG. 5A, no discoloration was observed on the surface of thelight emitting device of Example 2 even after 100 hours of PCT.

FIG. 5B is a photograph of the light emitting device of ComparativeExample 4, taken after 100 hours of PCT.

FIG. 5C is a photograph of the light emitting device of ComparativeExample 5, taken after 100 hours of PCT.

FIG. 5D is a photograph of the light emitting device of ComparativeExample 6, taken after 100 hours of PCT.

As shown in FIGS. 5B to 5D, no discoloration was observed on thesurfaces of the light emitting devices of Comparative Examples 4 to 6after 100 hours of PCT.

The results confirm the following matters. In such a light emittingdevice (i.e., a light emitting device including an encapsulation memberthat is composed of a first section that contains fluorescent materialparticles that are settled under centrifugal force, and that covers alight emitting element, and a second section that is provided on thefirst section, and that contains substantially no fluorescentmaterials), water in the air that enters through, for example, theinterface between the light emitting surface and the package is blockedby the second section and unlikely to reach the fluorescent materials,which are contained in the first section. Thus, the reaction betweenwater and the tetravalent manganese ion that is contained in thetetravalent manganese ion (Mn⁴⁺)-activated red-light fluorescentmaterial, can be prevented or reduced, and discoloring of the particlesurface due to the generation of manganese dioxide can be prevented orreduced. Hence, the light emitting device can demonstrate full moistureresistance in a long-term reliability test.

In such a light emitting device, water in the air is blocked by thesecond section, and is unlikely to reach the red-light fluorescentmaterial, which is contained in the first section, and thus Mn⁴⁺ and F,which are contained in the red-light fluorescent material, are preventedfrom eluding from the red-light fluorescent material, thereby preventingor reducing deterioration of the resin constituting the first sectionand the second section.

Examples 3 to 5, Comparative Examples 7 to 9, and Reference Example

The light emitting device according to Reference Example includes YAG asa fluorescent material. In Reference Example, a light emitting devicewas produced in the same manner as Example 2, except that YAG was usedas a fluorescent material. Examples 3 to 5 used the red-lightfluorescent material obtained in Production Example 1. In Examples 3 to5, a light emitting device was produced in the same manner as Example 2,using resin compositions 7 to 9, having the same components andformulation ratio as resin composition 1, except that the fluorescentmaterial shown in Table 5 was used as a green to yellow-light emittingfluorescent material. Comparative Examples 7 to 9 used a red-lightfluorescent material (CaAlSiN₃:Eu, hereinafter also referred to as“CASN”), which differs from the one used in Example 1. ComparativeExamples 7 to 9 used resin compositions 10 to 12 having the samecomponents and formulation ratio as resin composition 1, except that thegreen to yellow-light emitting fluorescent material (β-sialon) and thered-light fluorescent material (CASN) were formulated so that the massratio of the green to yellow-light emitting fluorescent material to thered-light fluorescent material (β-sialon:CASN) is 90:10. In ComparativeExamples 7 to 9, light emitting devices were produced in the same manneras Example 2 except that the resin compositions 10 to 12 were used. Allthe light emitting devices of Reference Example, Examples 3 to 5, andComparative Examples 7 to 9 had an encapsulation member 90 composed of afirst section 101 that includes fluorescent material particles and thatcovers light emitting elements 40, and a second section 102 that isprovided on the first section 101 and that contains substantially nofluorescent materials (see FIG. 2).

NTSC Ratio

The light emitting devices of Reference Example, Examples 3 to 5, andComparative Examples 7 to 9 were incorporated into image displayapparatuses. NTSC ratios of these image display apparatuses weredetermined.

The NTSC ratio is the ratio of the area of a triangle defined by threechromaticity points (red, green, blue) of the display apparatus to beevaluated to the area of a triangle defined by the chromaticity pointsof three primary colors, red (0.670, 0.330), green (0.210, 0.710), andblue (0.140, 0.080), of the standard chromaticity (x, y) according tothe CIE1931 XYZ display color system established by the NationalTelevision Standards Committee (NTSC) of the USA. The range of colorreproducibility is defined by the area ratio, and a higher area ratiomeans higher color reproducibility.

The range of color reproducibility of the image display apparatuspreferably has an NTSC ratio of 70% or higher in CIE1931 chromaticitycoordinate.

sRGB

The light emitting devices of Reference Example, Examples 3 to 5, andComparative Examples 7 to 9 were incorporated into image displayapparatuses. sRGB of these image display apparatuses were determined.

sRGB ratio is the ratio of the area of a triangle defined by threechromaticity points (red, green, blue) of the display apparatus to beevaluated to the area of a triangle defined by the chromaticity pointsof three primary colors, red (0.6400, 0.3300), green (0.3000, 0.6000),and blue (0.1500, 0.0600), of the standard chromaticity (x, y) accordingto the CIE1931 XYZ display color system established by the InternationalElectrotechnical Commission (IEC). The range of color reproducibility isdefined by the area ratio, and a higher area ratio means higher colorreproducibility.

Luminous Flux: Relative Flux (LED)

The luminous flux was each determined for the light emitting devices ofReference Example, Examples 3 to 5, and Comparative Examples 7 to 9,using an integrating sphere.

Table 5 shows the measurement results of the NTSC ratio, sRGB, andluminous flux of the light emitting devices (LED) of Reference Example,Examples 3 to 5, and Comparative Examples 7 to 9. The numerical valuesin parentheses for the fluorescent materials in Table 5 indicate theemission peak wavelength of the respective fluorescent materials.

TABLE 5 Fluorescent material Green light emitting Red-light RelativeRelative fluorescent fluorescent sRGB Brightness Flux material materialNTSC (U′V′ Area) (Panel) (LED) Reference YAG 70% 100% 100 100 ExampleExample 3 β-sialon Production 90% 135% 96 87 (540 nm) Example 1 (630 nm)Example 4 β-sialon Production 93% 137% 91 82 (535 nm) Example 1 (630 nm)Example 5 β-sialon Production 96% 139% 83 75 (531 nm) Example 1 (630 nm)Comparative β-sialon CASN 77% 123% 80 68 Example 7 (540 nm) (660 nm)Comparative β-sialon CASN 80% 127% 76 64 Example 8 (535 nm) (660 nm)Comparative β-sialon CASN 83% 130% 70 58 Example 9 (531 nm) (660 nm)

As shown in Table 5, the light emitting devices of Examples 3 to 5demonstrated numerical values superior to those of the light emittingdevices of Comparative Examples 7 to 9 in all of NTSC ratio, sRGB, andluminous flux (LED). Thus, both color reproducibility and luminous flux(LED) have been improved. The light emitting devices of ComparativeExamples 7 to 9 were inferior in luminous flux, showing 68, 64, and 58relative to the luminous flux 100 of the light emitting device ofReference Example. In contrast to the light emitting devices ofComparative Examples 7 to 9, the light emitting devices of Examples 3 to5 have improved in luminous flux, showing 87, 82, and 75.

Examples 6 to 11

As the nanoparticles, zirconia nanoparticles and/or silica nanoparticleswas used. Resin compositions 13 to 18, which have the same componentsand formulation ratio as resin composition 1, were used, except that thenanoparticles and the fluorescent material in the resin compositionswere formulated as shown in Table 6. Light emitting devices wereproduced in the same manner as Example 1 except that resin compositions13 to 18 were used. The nanoparticles used in the resin compositions areas follows. Zirconia nanoparticles and/or silica nanoparticles wassubstantially uniformly dispersed in encapsulation member 9.

Zirconia nanoparticles (zirconium dioxide, the number average primaryparticle size as determined by TEM: 5 nm)

Silica nanoparticles (silica, the number average primary particle sizeas determined by TEM: 12 nm)

Comparative Example 10

Resin composition 19 was used, which has the same components andformulation ratio as resin composition 1, except that the resincomposition contains no zirconia nanoparticles or silica nanoparticles.A light emitting device was produced in the same manner as Example 1,except that the resin composition 19 was used.

Light Lumen Maintenance Factor (%)

The resultant light emitting devices were placed in a thermostaticchamber that is set at a temperature of 85° C. and 85% humidity, and areliability test of the light emitting devices were performed bylighting at 1 mA. The reliability for the light emitting devices waseach determined by light lumen maintenance factor, which was obtained bymeasuring the luminous flux after lighting for 1993 hours relative tothe initial luminous flux in the thermostatic chamber.

Light lumen maintenance factor (%)=(luminous flux after 1993hours/initial luminous flux)×100

Table 6 shows the light lumen maintenance factors (%) of Examples 6 to11 and Comparative Example 10.

TABLE 6 Zirconia Silica Light nano- nano- Fluorescent lumen Resinparticle particle material maintenance (mass (mass (mass (mass factorparts) parts) parts) parts) (%) Comparative 100 — — 39 70.6 Example 10Example 6 — 0.4 36 85.9 Example 7 5 — 37 91.5 Example 8 20 — 36 91.8Example 9 0.8 0.4 37 84.5 Example 10 5 0.4 34 94.7 Example 11 20 0.4 3393.8

The light emitting devices of Examples 6 to 7, which include zirconiananoparticles and/or a specific amount of silica nanoparticles have alarger light lumen maintenance factor than the light emitting device ofComparative Example 10. Thus, they have superior durability in along-term reliability test. More specifically, Examples 6, 7, and 8,which include either one of zirconia nanoparticles or silicananoparticles, exhibit a higher light lumen maintenance factor thanComparative Example 10, which includes none of these particles. As shownin Examples 10 and 11, which include both zirconia nanoparticles andsilica nanoparticles each at a specific amount, exhibit a higher lightlumen maintenance factor than Examples 6, 7, and 8, which include eitherone of zirconia nanoparticles and silica nanoparticles alone.

Examples 12 to 14

Aluminum oxide nanoparticles, titanium oxide nanoparticles, and zincoxide nanoparticles were used, respectively, in Examples 12 to 14. Resincompositions 19 to 21, which have the same components and formulationratio as resin composition 1, were used, except that the nanoparticlesand the fluorescent materials in the resin composition were formulatedas shown in Table 7. Light emitting devices were produced in the samemanner as Example 1, except that the resin compositions 19 to 21 wereused. The nanoparticles used in the resin composition are as follows.

Aluminum oxide nanoparticles (the number average primary particle sizeas determined by TEM: 31 nm)

Titanium oxide nanoparticles (the number average primary particle sizeas determined by TEM: 36 nm) Zinc oxide nanoparticle (the number averageprimary particle size as determined by

TEM: 34 nm)

Light lumen maintenance factor (%)

The resultant light emitting devices were placed in a thermostaticchamber that is set to a temperature at 85° C. and at a humidity of 85%,and turned on at 1 mA, and a reliability test of the light emittingdevice was performed. The reliability of the light emitting devices waseach determined by the light lumen maintenance factor, which wasobtained by measuring the luminous flux after lighting for 352 hoursrelative to the initial luminous flux in the thermostatic chamber.

Light lumen maintenance factor (%)=(luminous flux after 352hours/initial luminous flux)×100

Table 7 shows the light lumen maintenance factors (%) of Examples 12 to14 and Comparative Example 11.

TABLE 7 Fluo- Light Nano- rescent lumen Resin Nano- particle materialmain- (mass particle (mass (mass tenance parts) material parts) parts)factor (%) Comparative 100 — — 35 88.9 Example 11 Example 12 Aluminum0.8 35 93.5 oxide Example 13 Zinc oxide 0.8 35 92.1 Example 14 Titaniumoxide 0.8 35 93.2

The light emitting devices according to one mode of the presentdisclosure have successfully reduced the losses in emission output andthe generation of chromaticity change, and can be advantageously used,in particular, as light sources for white illumination using a bluelight emitting diode as a light source, light sources for backlights,LED displays, traffic lights, illuminated switches, various sensors andvarious indicators, for example, and exhibit superior durability,reliability, and light emission properties, in particular, forillumination.

As described above, it should be obvious that various other embodimentsare possible without departing the spirit and scope of the presentinvention. Accordingly, the scope of the present invention should belimited only by the following claims and their equivalents.

All publications, patent applications, and technical standards mentionedin this specification are herein incorporated by reference to the sameextent as if each individual publication, patent application, ortechnical standard was specifically and individually indicated to beincorporated by reference.

What is claimed is:
 1. A resin composition comprising: a fluorescentmaterial; a resin; and nanoparticles selected from at least one of thegroup consisting of aluminum oxide nanoparticles, titanium oxidenanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles,and silicon oxide nanoparticles, wherein when the resin compositionincludes silicon oxide nanoparticles, the content of the silicon oxidenanoparticles is 0.02 to 5 mass parts relative to 100 mass parts of theresin, and wherein the fluorescent material is a red-light emittingfluorescent material including a fluoride material having a chemicalcomposition that includes tetravalent manganese, at least one selectedfrom the group consisting of alkali metal elements and NH₄ ⁺, and atleast one selected from the group consisting of elements from Group 4 ofthe periodic table and elements from Group 14 of the periodic table. 2.The resin composition according to claim 1, wherein the fluorescentmaterial has a surface region with a lower tetravalent manganese ionconcentration than the inner region of the fluorescent material.
 3. Theresin composition according to claim 1, wherein the fluorescent materialhas a chemical composition represented by the formula (I):A₂[M_(1-x)Mn⁴⁺ _(x)F₆] wherein A is at least one selected from the groupconsisting of alkali metal elements and NH₄ ⁺; M is at least oneselected from the group consisting of elements from Group 4 of theperiodic table and elements from Group 14 of the periodic table; and xsatisfies 0<x<0.2.
 4. A light emitting device comprising: a package; alight emitting element disposed in the package; an encapsulation memberthat covers the light emitting element, the encapsulation member beingformed from a resin composition that contains a fluorescent material, aresin, and nanoparticles selected from at least one of the groupconsisting of aluminum oxide nanoparticles, titanium oxidenanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles,and silicon oxide nanoparticles, wherein when the resin compositionincludes silicon oxide nanoparticles, the content of the silicon oxidenanoparticles is 0.02 to 5 mass parts relative to 100 mass parts of theresin; and wherein the fluorescent material is a red-light emittingfluorescent material including fluoride material having a chemicalcomposition that includes tetravalent manganese, at least one selectedfrom the group consisting of alkali metal elements and NH₄ ⁺, and atleast one selected from the group consisting of elements from Group 4 ofthe periodic table and elements from Group 14 of the periodic table. 5.The light emitting device according to claim 4, wherein the fluorescentmaterial has a surface region with a lower tetravalent manganese ionconcentration than the inner region of the fluorescent material.
 6. Thelight emitting device according to claim 4, wherein the fluorescentmaterial has a chemical composition represented by the formula (I):A₂[M_(1-x)Mn⁴⁺ _(x)F₆]  (I) wherein A is at least one selected from thegroup consisting of alkali metal elements and NH₄ ⁺; M is at least oneselected from the group consisting of elements from Group 4 of theperiodic table and elements from Group 14 of the periodic table, and xsatisfies 0<x<0.2.
 7. The light emitting device according to claim 4,wherein the nanoparticles selected from at least one of the groupconsisting of aluminum oxide nanoparticles, titanium oxidenanoparticles, zinc oxide nanoparticles, and zirconium oxidenanoparticles are present in the resin composition in an amount of 0.1to 30 mass parts relative to 100 mass parts of the resin.
 8. The lightemitting device according to claim 4, wherein the nanoparticles includezirconium oxide nanoparticles.
 9. The light emitting device according toclaim 4, wherein the nanoparticles include aluminum oxide nanoparticles.10. The light emitting device according to claim 4, wherein thenanoparticles include titanium oxide nanoparticles.
 11. The lightemitting device according to claim 4, wherein the nanoparticles includezinc oxide nanoparticles.
 12. The light emitting device according toclaim 4, wherein the nanoparticles include silicon oxide nanoparticlesand zirconium oxide nanoparticles.
 13. The light emitting deviceaccording to claim 4, wherein the nanoparticles have a number averageprimary particle size of 1 nm to 100 nm.
 14. The light emitting deviceaccording to claim 4, wherein M in the formula (I) is at least oneelement selected from the group consisting of titanium (Ti), zirconium(Zr), hafnium (Hf), silicon (Si), germanium (Ge), and tin (Sn).
 15. Thelight emitting device according to claim 4, wherein the light emittingelement has an emission peak wavelength in the range of 380 nm to 573nm.
 16. The light emitting device according to claim 4, wherein theresin contains phenyl silicone resin.
 17. The light emitting deviceaccording to claim 4, wherein the encapsulation member is composed of afirst section that contains the resin, the nanoparticles, and thefluorescent material and that covers the light emitting element, and asecond section that is provided on the first section, and that containsthe resin, the nanoparticles, and substantially no fluorescent material.18. The light emitting device according to claim 17, wherein thenanoparticles are substantially uniformly dispersed in the first sectionand the second section.
 19. The light emitting device according to claim4, wherein the fluorescent material absorbs light having a maximumwavelength in the range of 380 nm to 485 nm, and further contains agreen to yellow-light emitting fluorescent material having an emissionpeak wavelength in the range of 495 nm to 590 nm.
 20. The light emittingdevice according to claim 19, wherein the green to yellow-light emittingfluorescent material includes at least one fluorescent material selectedfrom the group consisting of a β-sialon having a compositional formularepresented by (Si,Al)₆(O,N)₈:Eu, a halosilicate having a compositionalformula represented by (Ca,Sr,Ba,Zn)₈MgSi₄O₁₆(F,Cl,Br,I)₂:Eu, analkaline-earth thiogallate having a compositional formula represented by(Ba,Sr,Ca)Ga₂S₄:Eu, and a rare-earth aluminate having a compositionalformula represented by (Y,Lu)₃(Al,Ga)₅O₁₂:Ce.
 21. The light emittingdevice according to claim 19, wherein a mass ratio of the green toyellow-light emitting fluorescent material to the red-light fluorescentmaterial is from 5:95 to 95:5.